Full-automatic wafer wax pasting machine

Abstract

The invention discloses a full-automatic wafer wax pasting machine which comprises a wafer supply unit, a mechanical arm, a wafer cleaning unit, a centering unit, a wax dripping unit, a double-arm wafer transplanting unit, a wafer overturning unit, a wafer pressing unit, a ceramic plate heating unit, a turnover unit, a cooling unit and a carrier. A wafer passes through the wafer supply unit, the manipulator, the wafer cleaning unit, the centering unit, the double-arm wafer transplanting unit, the wax dripping unit, the wafer overturning unit, the ceramic plate heating unit, the wafer pressing unit, the turnover unit and the cooling unit to be assembled with a ceramic plate. According to the automatic wax dripping device, the functions of automatic feeding, automatic cleaning, automatic wax dripping, automatic baking, automatic overturning, automatic pressing, automatic heating, automatic turnover and automatic cooling are integrated, the production efficiency of products is greatly improved, and automatic production is achieved.

Description

technical field [0001] The invention relates to a fully automatic wafer wax sticking machine. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. The domestic wafer production line is mainly 8 inches and 12 inches; [0003] With the rapid growth of demand for installed capacity in China's semiconductor market, labor shortages and rising labor costs have led to an increase in manufacturers' demand for automation equipment, which has a significant effect on reducing production costs and improving product yield. [0004] Existing wafers (sapphire wafers, silicon wafers, etc.) require multiple processes during processing, such as clea...

AI Technical Summary

Problems solved by technology

However, in the prior art, there are also automation equipment for wafer placement, cleaning, shoveling, and ceramic disk cleaning and storage, but these equipment structures are relatively complicated, and the working procedures are cumbersome when used; The requirements on the surface of the wafer are relatively high, and collisions or dust on the surface of the wafer cannot be avoided during the transfer process, which affects product quality, which makes the processing efficiency of the wafer extremely low; for example, the application number is: "CN201910746988.9". Automatic wafer cleaning and placement machine: "Including ceramic disk cleaning conveyor line and wafer chip placement line, the ceramic disk cleaning conveyor line is used to clean the ceramic disk and send the ceramic disk to the wafer chip placement line, There are two wafer placement lines, which are respectively arranged at the output end of the ceramic disk cleaning conveying line, and are used for attaching wafers to the cleaned ceramic disk; the ceramic disk cleaning conveying line is provided with a ceramic disk A feeding mechanism and a ceramic disk cleaning mechanism, the ceramic disk feeding mechanism is used to take out the stored ceramic disks, and the ceramic disk cleaning mechanism is correspondingly arranged at the output end of the ceramic disk feeding mechanism, and is used to receive the ceramic disk feeding mechanism The incoming ceramic discs are cleaned vertically; the wafer placement line is equipped with a carrying basket mechanism, a scrubbing and drying mechanism, a wax spreading mechanism, a baking mechanism, a shaping edge-seeking mechanism, and a patch flat mechanism , transfer manipulator and ceramic plate discharge mechanism,......

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