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Substrate with PIN structure and manufacturing method thereof

A substrate manufacturing and substrate technology, which is applied in printed circuit manufacturing, electrical components, printed circuit components, etc., can solve the problems of poor electrical conductivity and heat dissipation function, unreliable welding quality, and complicated manufacturing process, and achieves low cost and high efficiency. The effect of industrialized mass production efficiency and simple process

Pending Publication Date: 2022-04-15
井敏
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the prior art, the manufacturing process of the substrate with the PIN structure is complicated, time-consuming, and high in cost, and the existing process usually solders the PIN corners on the substrate separately after the substrate is manufactured to achieve metallization interconnection , often have the disadvantages of unreliable welding quality, poor electrical conductivity and heat dissipation

Method used

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  • Substrate with PIN structure and manufacturing method thereof
  • Substrate with PIN structure and manufacturing method thereof
  • Substrate with PIN structure and manufacturing method thereof

Examples

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Effect test

Embodiment 1

[0055] This embodiment adopts the above-mentioned method for manufacturing a substrate with a PIN structure. Specifically, the materials of the substrate, metal parts, and metallized ceramic substrate in this embodiment are respectively selected as: alumina ceramic substrate, copper needle, and copper. Taking this as an example to illustrate the method of manufacturing an alumina ceramic substrate with a PIN structure, the specific steps are as follows,

[0056] On the alumina ceramic substrate with a specification of 138*190*0.89mm, laser drilled 40 holes with a diameter of 1mm; the size of the 40 holes was Copper needle pre-oxidation treatment, the oxygen concentration is 500PPM, the temperature is 950 ° C, and the oxidation time is 15 minutes to oxidize the copper needle; 20 copper needles are penetrated into 20 ceramic holes, and 10 pieces of alumina ceramic substrates are connected in series; 10 pieces of alumina ceramic substrates are placed in an inert gas protection si...

Embodiment 2

[0058] This embodiment adopts the above-mentioned method for manufacturing a substrate with a PIN structure. Specifically, the materials of the substrate, metal parts, and metallized ceramic substrate in this embodiment are respectively selected as: zirconia toughened alumina ceramic (ZTA) substrate , copper needles, copper. Taking this as an example to illustrate the production method of the alumina ceramic substrate with a PIN structure, the specific steps are as follows, laser drilling 80 holes on the zirconia toughened alumina ceramics with a specification of 138*190*0.38mm, and the diameter of the through holes is 0.40mm; the specification of 80 pieces is The copper wire has been pre-oxidized on the surface; the copper wire is oxidized under the conditions of oxygen concentration of 550PPM, 650°C, and 15min. After the copper wire is oxidized, cuprous oxide will be formed on the surface, and copper will undergo a chemical reaction in a weak oxygen environment: O 2 +Cu—Cu...

Embodiment 3

[0060] This embodiment adopts the above-mentioned method for manufacturing a substrate with a PIN structure. Specifically, the materials of the substrate and the metal parts in this embodiment are respectively selected as: an aluminum nitride ceramic substrate and a copper wire. Take this as an example to illustrate the production method of aluminum nitride ceramic copper-clad ceramic substrate with PIN structure. The specific steps are as follows. Drill 48 holes in the aluminum nitride ceramic substrate with a size of 112*112*0.635mm, and the hole diameter is 0.50mm ; Pass 48 copper wires with a specification of 100*φ0.45mm through the use of pre-coated AgCuTi solder, and discharge the organic matter in the slurry under the conditions of a temperature of 500 ° C and an oxidation time of 60 minutes. In a vacuum of 10 -3 Under the conditions of Pa, 720°C and 10min, the surface of the copper wire is pre-alloyed; 16 surface-treated copper wires are penetrated into the correspondi...

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Abstract

The invention discloses a substrate with a PIN structure and a manufacturing method thereof, and belongs to the field of component manufacturing. The method comprises the following steps: punching a through hole in a preset position on a ceramic plate; after part of the through holes are selectively metalized, the single face of the ceramic substrate is metalized, a needed circuit pattern is machined, a metal piece subjected to surface treatment penetrates into the rest of the through holes which are not metalized and then is sintered, the metal piece is cut off after the ceramic substrate is sintered, and the ceramic holes with the metal piece are ground to be flat, so that the metal piece is formed. And keeping the cross section of the metal wire and the ceramic substrate on the same horizontal plane, finally carrying out metallization treatment on the other surface of the ceramic substrate, processing a required circuit pattern, and cutting to form small units of the ceramic substrate, thereby realizing the method for manufacturing the ceramic substrate with the PIN structure.

Description

technical field [0001] The invention discloses an ultra-narrow line width and line distance metallized ceramic substrate and a manufacturing method thereof, belonging to the field of component manufacturing. Background technique [0002] There are currently two methods for interconnecting the upper and lower conductive layers of the ceramic substrate. One method is to first laser drill the ceramic substrate, sinter a layer of copper on the surface of the ceramic, then manually put the copper disc (copper sheet) or copper ball into the ceramic hole, and then put the other side of the ceramic at 1065-1083 ° C Sinter a layer of copper layer at a certain sintering temperature, and finally apply a certain pressure on the position of the hole to deform the upper and lower copper layers on the surface of the ceramic substrate and fully contact the copper disc or copper ball implanted in the ceramic hole to realize the interconnection of the upper and lower copper layers; Another m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/10H05K1/02
Inventor 井敏
Owner 井敏
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