Thick-film resistor paste

A thick film resistor and paste technology, applied in conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of large electrostatic discharge changes, wide TCR range, poor resistance value accuracy, etc. The effect of sintering stability, improving resistance accuracy and reliability

Active Publication Date: 2022-04-19
西安宏星电子浆料科技股份有限公司
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resistance paste prepared by the traditional process has poor resistance accuracy, wide TCR range, large electrostatic discharge changes, and poor reliability under high temperature, high humidity, high cold, vibration and long-term power load working conditions

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thick-film resistor paste
  • Thick-film resistor paste
  • Thick-film resistor paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, which do not limit the protection scope of the present invention. The protection scope of the present invention is only limited by the claims, and any omission, replacement or modification made by those skilled in the art on the basis of the disclosed embodiments of the present invention will fall within the protection scope of the present invention.

[0015] 1. Preparation of conductive phase

[0016] Conductive phase 1: set the specific surface area to 5-65m 2 / g of ruthenium dioxide and lead ruthenate with a particle size ranging from 0.7 to 1.3 μm were mixed at a mass ratio of 1:4 to prepare conductive phase 1.

[0017] Conductive phase 2: Dissolve boric acid in methanol to form a boric acid solution with a mass concentration of 2%, then stir and disperse the conductive phase 1 in the boric acid solution, and the mass ratio of the conducti...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
specific surface areaaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to view more

Abstract

The invention discloses thick-film resistor paste. The thick-film resistor paste is composed of a conductive phase, a glass binding phase, an inorganic additive and an organic carrier, the conductive phase is conductive powder uniformly coated with boric acid, which is obtained by dispersing conductive powder in a methanol solution of boric acid and carrying out surface boric acid coating treatment. Ruthenium dioxide with extremely low resistivity and lead ruthenate with high resistivity are adopted as conductive powder, so that the resistance paste has the characteristics of good resistance stability, excellent voltage resistance, power resistance and reliable service life under different resistance values, and the resistor has good compactness after being sintered; the surface of the conductive powder is subjected to boric acid coating treatment, so that a layer of boric acid is formed on the surface of the conductive powder, agglomeration of a conductive phase in the resistance paste is solved due to decomposition of boric acid in the use process of the resistance paste, wettability of the conductive phase and an organic carrier is improved, the conductive phase in the prepared resistance paste can be dispersed more uniformly, and the conductivity of the resistance paste is improved. And the resistance precision and reliability of the slurry are improved.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a resistor paste for thick film circuits. Background technique [0002] High-performance thick-film circuits are mainly used in aviation, aerospace, high-power, high-precision, high-tech cutting-edge technology products and other fields that have high reliability requirements for thick-film circuits. At present, the global demand for high-performance thick-film circuit products is increasing Therefore, the electronic paste required for the preparation of high-performance thick film circuits, especially the resistance paste products, has higher requirements. [0003] High-performance thick-film circuit products will be subjected to high temperature, high humidity, high cold, vibration and high power during application. Therefore, resistor paste products must have the characteristics of high resistance value accuracy, good stability, and extremely high power re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/14H01B1/20
CPCH01B1/14H01B1/20
Inventor 不公告发明人
Owner 西安宏星电子浆料科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap