Extensible implant microsystem heterogeneous integration method without leveling process

Abstract

The invention discloses an extensible implant microsystem heterogeneous integration method without a leveling process, and aims to solve the problems that a silicon substrate is used in a traditional heterogeneous integration process to be matched with an integrated circuit photoetching process and a deep chip groove is formed by adopting technologies such as deep silicon etching and the like to prevent a chip from being damaged due to the fact that existing biological implantable equipment faces multifunctional and miniaturized integration requirements. The requirement for the precision of the chip thinning process is large, bottom filling materials are usually adopted for leveling the chip and a silicon substrate, and the thin chip is extremely prone to fragmentation; the large-scale batch manufacturing of the heterogeneous integrated implanted microsystem is limited; according to the invention, the PDMS material is adopted as the carrier to wrap the device to be integrated, so that the carrier substrate which can be used for RDL wiring in the subsequent process and integrates various devices can be formed without a leveling process; the packaging chips are connected by using the conductive adhesive, so that the microsystem heterogeneous integration of the chips with various architectures and the SMD device is realized; and the heterogeneous integrated batch manufacturing capability of the implantable device is improved.

Description

technical field [0001] The invention relates to the field of implant integration technology, in particular to an expandable implant microsystem heterogeneous integration method without leveling process. Background technique [0002] Implanted micro-system devices are used to connect and monitor human physiological activity signals, such as heartbeat, sweat and other activity characteristics, to monitor human physiological activities in real time, and to detect and deal with abnormal conditions in a timely manner. Implantable microsystems have broad application prospects in medical implantable devices and so on. [0003] Existing implantable physiological monitoring microsystems mainly use polyimide-based flexible substrates based on printed circuit board assembly (PCBA) technology to achieve miniaturization and flexibility. However, the existing PCBA implantable monitoring systems There are usually disadvantages of large size and high power consumption, and the smallest vol...

AI Technical Summary

Problems solved by technology

The accuracy of the chip thinning process has a great influence on the subsequent processing, so the underfill material is usually used to level the chip and the silicon substrate, but due to the characteristics of the extremely thin chip, it is easy to break during the leveling process. Limiting Large-Scale Batch Manufacturing of Heterogeneously Integrated Implantable Microsystems

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