Supercharge Your Innovation With Domain-Expert AI Agents!

Method for manufacturing copper-based monotectic high-entropy alloy through ultrahigh-speed laser-induction composite cladding additive

A high-entropy alloy and additive manufacturing technology, which is applied in the direction of additive manufacturing, additive processing, and energy efficiency improvement, can solve the problems of undiscovered copper-based monotectic high-entropy alloys, and achieve resistance to current-carrying wear and arc burning Corrosion, high thermal conductivity and high electrical conductivity, high radiation resistance

Active Publication Date: 2022-05-13
JINAN UNIVERSITY
View PDF11 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So far, no domestic and foreign research reports on the preparation of copper-based monotectic high-entropy alloys by using ultra-high-speed laser-induction composite cladding additive manufacturing technology have been found.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The sandblasted 304 stainless steel plate was used as the base material, and the copper-based monotectic high-entropy alloy was prepared by the ultra-high-speed laser-induction composite cladding additive manufacturing method. Due to the liquid phase separation, the solidification rate exceeded ~10 8 Under the condition of K / s, the microstructural characteristics of the obtained copper-based monotectic high-entropy alloy are: copper-rich layers and molybdenum-rich layers are formed alternately; among them, a large number of 5-10 micron spherical niobium-rich or molybdenum-rich particles are dispersedly distributed in the rich In the copper layer, a large number of 2-5 micron copper-rich or niobium-rich particles are evenly embedded in the molybdenum-rich layer. In addition, there are supersaturated Mo, Si and Al in solid solution in the copper-rich layer, and supersaturated Cu, Si and Al in solid solution in the molybdenum-rich layer. The electrical conductivity of copp...

Embodiment 2

[0039] The sandblasted brass plate was used as the base material, and the copper-based monotectic high-entropy alloy was prepared by the method of ultra-high-speed laser-induction composite cladding additive manufacturing. Due to the separation of the liquid phase, the solidification rate exceeded ~10 8 Under the condition of K / s, the microstructure characteristics of the obtained copper-based monotectic high-entropy alloy are: copper-rich layers and molybdenum-rich layers are formed alternately; among them, a large number of 10-15 micron spherical niobium-rich or molybdenum-rich particles are dispersedly distributed in the rich In the copper layer, a large number of 5-10 micron copper-rich or niobium-rich particles are evenly embedded in the molybdenum-rich layer. In addition, there are supersaturated Mo, Si and Al in solid solution in the copper-rich layer, and supersaturated Cu, Si and Al in solid solution in the molybdenum-rich layer. The electrical conductivity of copper-ba...

Embodiment 3

[0048] The sandblasted brass plate was used as the base material, and the copper-based monotectic high-entropy alloy was prepared by the method of ultra-high-speed laser-induction composite cladding additive manufacturing. Due to the separation of the liquid phase, the solidification rate exceeded ~10 8 Under the condition of K / s, the microstructural characteristics of the obtained copper-based monotectic high-entropy alloy are: copper-rich layers and molybdenum-rich layers are formed alternately; among them, a large number of 15-20 micron spherical niobium-rich or molybdenum-rich particles are dispersedly distributed in the rich In the copper layer, a large number of 10-15 micron copper-rich or niobium-rich particles are evenly embedded in the molybdenum-rich layer. In addition, there are supersaturated Mo, Si and Al in solid solution in the copper-rich layer, and supersaturated Cu, Si and Al in solid solution in the molybdenum-rich layer. The electrical conductivity of coppe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Tensile strengthaaaaaaaaaa
Tensile strengthaaaaaaaaaa
Tensile strengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for manufacturing a copper-based monotectic high-entropy alloy through an ultra-high-speed laser-induction composite cladding additive. The method comprises the steps that copper-based monotectic high-entropy alloy powder serves as forming powder; a laser beam and a coaxial powder nozzle are positioned in an induction heating area, and the copper-based monotectic high-entropy alloy is prepared point by point, line by line and layer by layer according to a series of two-dimensional scanning tracks obtained through layered slicing of a CAD model of the copper-based monotectic high-entropy alloy part; during ultra-high-speed laser-induction composite cladding additive manufacturing, each formed cladding layer is subjected to ultrasonic rolling treatment; and after one layer of cladding additive is manufactured, the machining head ascends in the Z direction, and cladding additive manufacturing of the next layer is conducted till manufacturing of the copper-based monotectic high-entropy alloy part is completed. The copper-based monotectic high-entropy alloy prepared through the method has the layered heterogeneous characteristic and has the properties of high strength, high toughness, high thermal stability, high radiation resistance, current-carrying wear resistance and arc ablation resistance.

Description

technical field [0001] The invention relates to a method for manufacturing copper-based monotectic high-entropy alloys by ultra-high-speed laser-induction composite cladding and additive manufacturing, and belongs to the technical field of laser additive manufacturing (3D printing). Background technique [0002] Monotectic alloys, also known as immiscible alloys, are a class of alloys with liquid-liquid two-phase separation. When cooled into the liquid phase separation temperature range, they form a dispersed, core / shell or layered structure, which has unique physical properties. And mechanical properties, as electrical contact materials, bearing materials, heat sink materials, brake pad materials, etc., it has broad application prospects in the industrial field. [0003] However, when such alloys are prepared by conventional melting and casting techniques, macrosegregation or layered structures are easily produced, which seriously restricts the excellent performance of this...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B22F10/28B22F10/50C22C1/05C22C1/10C22C9/00C22C30/02C22C32/00C22F1/08B33Y10/00B33Y40/00B33Y80/00
CPCB22F10/28B22F10/50C22C1/05C22C9/00C22C30/02C22C32/0021C22F1/08B33Y10/00B33Y40/00B33Y80/00Y02P10/25
Inventor 周圣丰张治国郭柏松易艳良李卫
Owner JINAN UNIVERSITY
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com