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Ground structure for building and construction technology of ground structure

A construction technology and building technology, applied in the direction of building structure, building, floor, etc., to achieve strong self-leveling, good heat storage effect, and reduce the bulk density of floor slabs

Pending Publication Date: 2022-05-13
新旺基科技工程集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the self-leveling mortar is applied to the ground structure in the prior art, it is still impossible to completely avoid the phenomenon of cracking, hollowing, sanding and peeling of the concrete floor.

Method used

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  • Ground structure for building and construction technology of ground structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] The embodiment of the invention discloses a ground structure for a building and its construction technology. The ground structure is as follows: figure 1 , including the floor of the original structure floor 1, also includes: bonding layer 2, insulation layer 3, concrete layer 4 and facing layer 5; its construction process is as follows:

[0058] (1) After cleaning the floor 1 of the original structure, check that its flatness is not greater than 4mm / 2m;

[0059] (2) Brush one deck interface agent 6 on the floor 1 of the original structure;

[0060] (3) After the interface agent 6 is dried and solidified, a 10mm thick silica sol adhesive 2 is laid, and before the adhesive layer 2 is solidified, the extruded polystyrene board on the insulation layer 3 is bonded firmly, wherein the thickness of the insulation layer is 9.5 mm, and during the laying of the insulation layer 3, ensure that the joint width between adjacent insulation boards is 0-1mm, and the flatness is not l...

Embodiment 2

[0064] A ground structure for a building building and a construction process thereof, which are different from Embodiment 1 in that:

[0065] (1) In step (3), the thickness of the bonding layer is 8mm;

[0066] (2) In the step (3), the insulation layer thickness is 13mm;

[0067] (3) The thickness of the concrete layer in step (4) is 25mm.

Embodiment 3

[0069] A ground structure for a building building and a construction process thereof, which are different from Embodiment 1 in that:

[0070] (1) In step (3), the thickness of the bonding layer is 6.5mm;

[0071] (2) In the step (3), the insulation layer is a cross-linked polyethylene cushion, and the thickness is 20mm;

[0072] (3) The thickness of the concrete layer in step (4) is 35mm.

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Abstract

The invention discloses a floor structure for a building and a construction process thereof, and belongs to the technical field of building construction technologies, the floor structure specifically comprises an original structure floor, and further comprises a facing material, a concrete layer, a heat preservation layer, a bonding layer and an adhesion agent; the bonding layer, the heat preservation layer, the concrete layer and the facing material are sequentially laid on the original structure building floor coated with the adhesion agent. The bonding layer is used for bonding the heat preservation layer and the original structure floor, the used silica sol binder can repair fine cracks and cavities in the original structure floor, and further cracking of the structural floor is avoided; in addition, primary rough leveling can be carried out on the bonding layer before concrete is poured, meanwhile, the heat preservation layer can be effectively fixed, and then construction of a follow-up structural layer is simplified. Besides, the technical problems of ground cracking, dusting and the like in the prior art can be solved by only needing the thickest thickness of the ground structure provided by the invention to be 7cm, so that the indoor height is increased, and the living experience of residents is improved.

Description

technical field [0001] The invention relates to the technical field of building construction, and more specifically relates to a building ground structure and a construction process thereof. Background technique [0002] Cement mortar floor is the most common structural form in the ground structure. It is often used by construction units for the building floor because of its low cost, convenient construction, and easy maintenance. However, there are many quality problems. The existing building construction process Among them, the concrete layer is usually directly bonded directly above the structural floor through the bonding method, but when the thickness of the concrete is thin, the bond is often not firm, and then the ground cracks, hollows, Sand, peeling and other phenomena. In addition, if the watering and maintenance are not timely after the ground pouring is completed, and the time for surface closing is not determined according to environmental factors such as weath...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/12E04F15/18
CPCE04F15/12E04F15/18E04F15/181
Inventor 郭宇鹏
Owner 新旺基科技工程集团有限公司
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