Miniaturized high-reliability external modulation light source packaging structure and packaging method

A technology of packaging structure and external modulation, which is applied to the packaging structure and packaging field of miniaturized high-reliability externally modulated light sources, can solve the problems of low reliability of pin assembly, affecting the long-term reliability of solder joints, large volume and weight, etc. Reliable electrical signal transmission, small structure and high stability of optical path

Active Publication Date: 2022-05-13
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) Large volume and weight: The packaging structure adopts the form of soldering pins drawn out from both sides, and the flat soldering pins are drawn out from both sides, and the interconnection with the inner side goes deep into the package through the inner ceramic wiring, and the ceramic occupies a relatively small area inside the module. Large space, resulting in large module size;
[0005] (2) Inconvenient installation and low reliability: the mounting ear of the packaging structure is located at the bottom of the device, and a thicker mounting plate is required to ensure the size of the hole. In addition, the material of the mounting ear is integrated with the chassis (usually WCu alloy), and the material is brittle. The fixing ear is easy to break during installation;
[0006] (3) The reliability of pin assembly is not high: the lead wires and mounting boards of the current packaging structure are mostly surface-mounted. When there is stress in the horizontal direction, it is easy to generate stress concentration at the solder joint, which affects the long-term reliability of the solder joint.

Method used

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  • Miniaturized high-reliability external modulation light source packaging structure and packaging method
  • Miniaturized high-reliability external modulation light source packaging structure and packaging method
  • Miniaturized high-reliability external modulation light source packaging structure and packaging method

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Embodiment

[0050] like Figure 1a , 1b , 1c, and 1d are schematic diagrams of the package structure of a miniaturized and highly reliable externally modulated light source proposed in this embodiment, as shown in Figure 2a , 2b Shown is a schematic installation diagram of a miniaturized and highly reliable externally modulated light source packaging structure proposed in this embodiment installed on the mounting base 6 and interconnected with the PCB 7 . This embodiment proposes a miniaturized and highly reliable externally modulated light source package structure, including a package shell 1, a ceramic circuit board 2, an optical coupling system 3, an optical base 4, and a thermoelectric cooler 5 (that is, a semiconductor cooler); the package The housing 1 includes a housing wall 11, close-packed glass terminals 12, and a bottom cooling plate 13; the optical coupling system 3 includes an aspheric lens 31, an isolation lens 32, and a metallized inclined optical fiber assembly 33 arrang...

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Abstract

The invention provides a miniaturized high-reliability external modulation light source packaging structure and a packaging method. The miniaturized high-reliability external modulation light source packaging structure comprises a packaging shell, a ceramic circuit board, an optical coupling system, an optical base and a thermoelectric refrigerating unit, the packaging shell comprises a shell wall body, densely-arranged glass terminals and a bottom heat dissipation disc; the optical coupling system comprises an aspherical lens, an isolation lens and a metalized inclined plane optical fiber assembly which are arranged in sequence; the shell wall body and the bottom heat dissipation disc are matched to form a packaging cavity; the ceramic circuit board, the optical coupling system, the optical base and the thermoelectric refrigerating unit are arranged in the packaging cavity; the densely-arranged glass terminal is sintered in one end face of the shell wall body; the ceramic circuit board, the optical base and the thermoelectric refrigerating unit are stacked and welded; and the thermoelectric refrigerating unit is welded on the bottom heat dissipation disc. Compared with the prior art, the invention has the advantages of small structural size, small system thermal resistance and high product reliability.

Description

technical field [0001] The invention relates to the technical field of packaging of optical communication devices, in particular to a packaging structure and packaging method for a miniaturized and highly reliable externally modulated light source. Background technique [0002] The externally modulated light source mainly produces laser with constant wavelength and constant intensity, which provides high-power stable optical signals for the external modulator, and finally realizes the electro-optic conversion function. It is the core device of the microwave optical transmission system and is widely used in various fields of military and civilian, including radar communication. , electronic countermeasures and other national defense fields. The packaging design of the externally modulated light source is mainly to reliably assemble the high-power semiconductor laser chip, ceramic circuit board, optical coupling system, and temperature control system in a closed package to rea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/428G02B6/4268G02B6/4256
Inventor 吕晓萌赵炳旭刘洋志伍艺龙李希斌朱云柯刘武广李文廖翱
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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