Filter fan-out packaging structure and manufacturing method thereof

Abstract

The invention discloses a filter fan-out packaging structure and a manufacturing method thereof, a filter chip comprises a resonance area and a non-resonance area outside the resonance area, a bonding pad is arranged on the non-resonance area, a bonding layer covers the surface of an additionally provided carrier plate wafer, a barrier layer is manufactured above the bonding layer, and the barrier layer is arranged on the surface of the carrier plate wafer. An alignment structure is formed on an enclosure layer or a non-resonance area, the position of the alignment structure corresponds to a bonding pad, a filter chip is attached to a carrier plate wafer in an alignment mode through the alignment structure so as to form a first cavity above a resonance area, and the back face and the side face of the filter chip and the back face and the side face of the enclosure layer are covered with a plastic package layer. And removing the carrier wafer and the bonding layer, manufacturing a protective layer on the enclosure layer, and arranging a metal connecting structure and a solder ball through a first through hole in the protective layer and the alignment structure. According to the invention, the problems of offset of fan-out packaging of the filter chip and LT wafer cracking can be solved, the mold pressing resistance of the cavity structure is effectively enhanced, the production cost is reduced, and ultrathin packaging is realized.

Description

technical field [0001] The invention relates to the field of filter packaging, in particular to a filter fan-out packaging structure and a manufacturing method thereof. Background technique [0002] With the rapid development of the communication field, since the filter plays an important role in the communication field, new progress is constantly being made. As a frequency selection device, the filter can pass specific frequency components in the signal and greatly attenuate other frequency components. In the field of modern communication technology, there is almost no branch that is not affected by filtering technology. Filters are widely used in source coding, channel coding, modulation, multiplexing, data compression, and adaptive channel equalization, especially in applications such as digital communication, network communication, and image communication. It was almost impossible to move an inch. [0003] At present, the main packaging technology of filters is still ...

AI Technical Summary

Problems solved by technology

[0004] 1. The cost of the surface sealing cover is relatively high;

[0005] 2. The reliability of the product has strict requirements on the flatness of the substrate and the sealing cover, which is easy to cause failure

[0006] 3. The thickness of the existing package is relatively thick, which does not meet the requirements of the current miniaturization trend of radio frequency devices

[0007] 4. The film-covered package on the surface of the device is sensitive to the size of the first cavity, and it is easy to cause film collapse in a large cavity size to affect the performance of the chip;

[0008] 5. At present, wafer-level packaging is mainly concentrated in 4 / 6 inches due to the ultra-thin LT wafer, and there is a high split rate, which affects the yield rate

[0009] Fan-out packaging of SAW devices can effectively solve and improve the above problems, but one of the challenges faced by fan-out packaging technology is chip offset, which brings difficulties to the alignment of subsequent photolithography processes

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