A design method for the layout of shield muck soil conditioner injection port
A technology of muck improvement and soil improvement agent, which is used in earthwork drilling, design optimization/simulation, computer-aided design, etc., can solve the problem of inability to accurately calculate the filling amount, injection pressure, unclear injection mechanism of muck improvement, cutting problems such as large resistance, to achieve the effect of improving the efficiency of muck improvement, reasonable design and layout results, and accurate and uniform coverage
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0125] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the embodiments and the accompanying drawings. Here, the exemplary embodiments of the present invention and their descriptions are used to explain the present invention, but not to limit the present invention.
[0126]In the present invention, unless otherwise expressly specified and limited, terms such as "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between the two elements or the interaction relationship between th...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com