Vertically arranged carbon fiber-polycarbonate heat-conducting composite material and preparation method thereof

A thermally conductive composite material, polycarbonate technology, applied in coatings, devices for coating liquids on surfaces, etc., can solve problems such as inability to have high thermal conductivity electronic devices, and achieve low equipment requirements, good product performance, and simple operation. Effect

Pending Publication Date: 2022-05-27
WUHAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current traditional thermally conductive composite materials cannot achieve high thermal conductivity in the ve

Method used

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  • Vertically arranged carbon fiber-polycarbonate heat-conducting composite material and preparation method thereof
  • Vertically arranged carbon fiber-polycarbonate heat-conducting composite material and preparation method thereof
  • Vertically arranged carbon fiber-polycarbonate heat-conducting composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0024] Example 1

[0025] Preparation of Vertically Aligned Carbon Fiber / Polycarbonate Composites:

[0026] Taking mesophase pitch-based carbon fibers and graphitizing them at 3000℃, high thermal conductivity carbon fibers were obtained, and their thermal conductivity was 900W·m -1 ·K -1 . Weigh 0.5 g of the cut fiber, and the fiber length is 1 mm. The fibers were evenly distributed on the circular iron sheet through the screen, and the electric field distance was set to 6 cm.

[0027] Paste a layer of polyimide glue on the upper end of the electrostatic flocking instrument, place the metal disc with fibers on the lower end of the instrument, and close the hatch. Turn on the instrument, adjust the voltage of the electric field to 20KV, and the fibers are adsorbed on the polyimide glue under the action of the electric field, showing a state of vertical arrangement, repeating several times until the fibers are covered with the entire polyimide glue.

[0028] 5g of polycarbo...

Example Embodiment

[0029] Example 2

[0030] The mesophase pitch-based carbon fiber was taken and graphitized at 3000 °C to obtain a high thermal conductivity carbon fiber with a thermal conductivity of 900 W m -1 •K -1 . Weigh 0.5 g of the cut fiber, and the fiber length is 1 mm. The fibers were evenly distributed on the circular iron sheet through the screen, and the electric field distance was set to 9 cm.

[0031] Paste a layer of polyimide glue on the upper end of the electrostatic flocking instrument, place the metal disc with fibers on the lower end of the instrument, and close the hatch. Turn on the instrument, adjust the voltage of the electric field to 20KV, and the fibers are adsorbed on the polyimide glue under the action of the electric field, showing a state of vertical arrangement, repeating several times until the fibers are covered with the entire polyimide glue.

[0032] 5 g of polycarbonate particles were dissolved in 20 g of tetrahydrofuran to form a mixed liquid with a c...

Example Embodiment

[0033] Example 3

[0034] Taking mesophase pitch-based carbon fibers and graphitizing them at 3000℃, high thermal conductivity carbon fibers were obtained, and their thermal conductivity was 900W·m -1 ·K -1 . Weigh 0.5 g of the cut fiber, and the fiber length is 1 mm. The fibers were evenly distributed on the circular iron sheet through the screen, and the electric field distance was set to 12 cm.

[0035] Paste a layer of polyimide glue on the upper end of the electrostatic flocking instrument, place the metal disc with fibers on the lower end of the instrument, and close the hatch. Turn on the instrument, adjust the voltage of the electric field to 20KV, and the fibers are adsorbed on the polyimide glue under the action of the electric field, showing a state of vertical arrangement, repeating several times until the fibers are covered with the entire polyimide glue.

[0036] 5 g of polycarbonate particles were dissolved in 20 g of tetrahydrofuran, and the polycarbonate p...

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Abstract

The invention discloses a vertically arranged carbon fiber-polycarbonate heat conduction composite material. The preparation method comprises the following steps: taking mesophase pitch-based carbon fibers, graphitizing the mesophase pitch-based carbon fibers, and shearing the mesophase pitch-based carbon fibers to obtain a plurality of chopped carbon fibers; forming the plurality of chopped carbon fibers into a vertically arranged high-density carbon fiber array by using an electrostatic flocking method; the preparation method comprises the following steps: dissolving polycarbonate particles in tetrahydrofuran to form a mixed liquid; and pouring the mixed liquid into a vertically arranged high-density carbon fiber array, and carrying out vacuum liquid-phase impregnation, so as to obtain the vertically arranged carbon fiber-polycarbonate heat-conducting composite material after the polycarbonate is cured. According to the composite material, mesophase pitch-based carbon fibers are used as a heat-conducting filler, and the carbon fibers are vertically arranged in the composite material, so that the heat conductivity of the composite material in the vertical direction is greatly enhanced, and the product performance is good; the preparation method is simple to operate, short in preparation period and low in requirements on equipment.

Description

technical field [0001] The invention relates to a thermally conductive composite material, in particular to a vertically arranged carbon fiber-polycarbonate thermally conductive composite material and a preparation method thereof. Background technique [0002] Due to the ever-increasing power density and consumption, thermal management has become one of the most important issues in electronic devices such as integrated circuits, and the use of heat sinks is integral to protecting modern electronics from thermal failures. Thermal management of electronic devices is difficult because conventional electronic devices are made of rigid materials with high thermal conductivity, such as metals. When the surface of the electronic device and the metal plate heat sink come into contact, perfect contact cannot be made due to the difference in height between the two surfaces. It is well known that two rigid planes only touch at three points, resulting in poor thermal contact. At prese...

Claims

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Application Information

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IPC IPC(8): C08L69/00C08K3/04B05D1/16
CPCC08K3/04B05D1/16C08L2203/20C08L69/00
Inventor 李艳军周航李轩科董志军李保六朱辉
Owner WUHAN UNIV OF SCI & TECH
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