Vertically arranged carbon fiber-polycarbonate heat-conducting composite material and preparation method thereof

Abstract

The invention discloses a vertically arranged carbon fiber-polycarbonate heat conduction composite material. The preparation method comprises the following steps: taking mesophase pitch-based carbon fibers, graphitizing the mesophase pitch-based carbon fibers, and shearing the mesophase pitch-based carbon fibers to obtain a plurality of chopped carbon fibers; forming the plurality of chopped carbon fibers into a vertically arranged high-density carbon fiber array by using an electrostatic flocking method; the preparation method comprises the following steps: dissolving polycarbonate particles in tetrahydrofuran to form a mixed liquid; and pouring the mixed liquid into a vertically arranged high-density carbon fiber array, and carrying out vacuum liquid-phase impregnation, so as to obtain the vertically arranged carbon fiber-polycarbonate heat-conducting composite material after the polycarbonate is cured. According to the composite material, mesophase pitch-based carbon fibers are used as a heat-conducting filler, and the carbon fibers are vertically arranged in the composite material, so that the heat conductivity of the composite material in the vertical direction is greatly enhanced, and the product performance is good; the preparation method is simple to operate, short in preparation period and low in requirements on equipment.

Description

technical field [0001] The invention relates to a thermally conductive composite material, in particular to a vertically arranged carbon fiber-polycarbonate thermally conductive composite material and a preparation method thereof. Background technique [0002] Due to the ever-increasing power density and consumption, thermal management has become one of the most important issues in electronic devices such as integrated circuits, and the use of heat sinks is integral to protecting modern electronics from thermal failures. Thermal management of electronic devices is difficult because conventional electronic devices are made of rigid materials with high thermal conductivity, such as metals. When the surface of the electronic device and the metal plate heat sink come into contact, perfect contact cannot be made due to the difference in height between the two surfaces. It is well known that two rigid planes only touch at three points, resulting in poor thermal contact. At prese...

AI Technical Summary

Problems solved by technology

However, the current traditional thermally conductive composite materials cannot achieve high thermal conductivity in the vertical direction to solve the thermal management problems caused by the increasing functional density of electronic devices.

Images