High-efficiency heat-dissipation deep-etching double-channel ridge-shaped quantum cascade laser and manufacturing method thereof
A technology of quantum cascade and manufacturing method, applied in the directions of lasers, phonon exciters, laser parts, etc., can solve the problems of increased strain in the active region, current limitation on both sides of the ridge, and decreased optical field confinement ability, etc. The effect of reducing strain, improving device heat dissipation, improving device life and working stability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0036] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0037] like figure 1 , figure 2 and image 3 , the embodiment of the present invention discloses a method for manufacturing a high-efficiency heat-dissipating deep-etched double-channel ridge-shaped quantum cascade laser, the steps comprising:
[0038] (a)-(b) growing the lower cladding layer 2, the active region 3 and the upper cladding layer 4 on the InP substrate 1;
[0039] Among them, after the lower cladding layer 2 is grown...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com