Semiconductor circuit structure and manufacturing method thereof

Abstract

The invention discloses a semiconductor circuit structure and a manufacturing method thereof. The semiconductor circuit structure comprises a substrate, a chip resistor, a chip capacitor, a component, a driving chip, a circuit board frame, pins and a packaging body, the chip resistor, the chip capacitor, the component and the circuit board frame are all arranged on the substrate, and the driving chip is arranged on the circuit board frame; one end of the pin is electrically connected with the substrate, the substrate, the chip resistor, the chip capacitor, the component, the driving chip, the circuit board frame and one end of the pin are packaged into a plastic package structure by the packaging body, and the other end of the pin extends to the outer side of the plastic package structure; the driving chip is electrically connected with the chip resistors, the chip capacitors, the components, the pins and the circuit board frame; according to the semiconductor circuit structure and the manufacturing method thereof, the driving chip is welded to the circuit board frame, integration of the semiconductor circuit structure is achieved, meanwhile, separation of strong current and weak current can be achieved, and the anti-interference capacity of a product is improved.

Description

technical field [0001] The present invention relates to the field of semiconductors, and in particular, to a semiconductor circuit structure and a manufacturing method thereof. Background technique [0002] The semiconductor circuit structure, that is, the modular intelligent power system MIPS not only integrates the power switching device and the driving circuit, but also has built-in fault detection circuits such as overvoltage, overcurrent and overheating, and can send the detection signal to the CPU or DSP for processing. interrupt handling. It is composed of high-speed and low power consumption die, optimized gate-level drive circuit and fast protection circuit. Even in the event of a load accident or improper use, the MIPS itself is not damaged. MIPS generally use IGBTs as power switching elements, and incorporate an integrated structure of current sensors and drive circuits. [0003] The existing MIPS modular intelligent power system IC drive control circuit, MIPS ...

AI Technical Summary

Problems solved by technology

[0003] The existing MIPS modular intelligent power system IC drive control circuit, MIPS sampling amplifier circuit, PFC current protection circuit and other low-voltage control circuits and inverter circuits composed of high-voltage semiconductor circuit structures are laid out on the same board. At the same time, the existing MIPS modular intelligent power The system only integrates a single MIPS module, and the integration of multiple MIPS modular intelligent power systems has not yet been realized. In the face of market miniaturization and low-cost competition, higher integration and high heat dissipation technologies for MIPS modular intelligent power systems have been proposed. requirements

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