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Slag-water separation and collection system for cutting cavity of cutting machine and dicing saw

A slag-water separation and collection system technology, applied in separation methods, filtration separation, chemical instruments and methods, etc., can solve the problems of easy slag accumulation in waterproof armor, low service life, and easy-to-moisture components, so as to achieve thorough cleaning, more timely, The effect of long service life and small footprint

Active Publication Date: 2022-07-12
苏州和研精密科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of waterproof armor that is not easy to accumulate slag, and the related parts under the workbench are not easy to get wet, and the service life of the cutting machine is improved. Separate the collection system and the dicing machine to solve the technical problems of the prior art dicing machine that the upper end of the waterproof armor is easy to accumulate slag and cannot be cleaned in time, and the related parts under the workbench are easy to be affected by moisture and have a low service life.

Method used

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  • Slag-water separation and collection system for cutting cavity of cutting machine and dicing saw
  • Slag-water separation and collection system for cutting cavity of cutting machine and dicing saw
  • Slag-water separation and collection system for cutting cavity of cutting machine and dicing saw

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Embodiment Construction

[0063] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0064] like Figure 1-18 As shown, an embodiment of the present invention provides a cutting machine cutting cavity slag water separation and collection system, including a cutting cavity part 1 mainly used for cutting workpieces and a filter cavity part used for filtering the cutting fluid produced by the cutting cavity part 1 2. The cutting cavity part 1 includes a feeding plate 7, a waterproof armor 8, a water tank 11 and a first brush body 9, wherein the feeding plate 7 is provided with a worktable 5, and the...

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Abstract

The invention provides a cutting machine cutting cavity slag-water separation and collection system and a dicing saw, and relates to the technical field of cutting, the cutting machine cutting cavity slag-water separation and collection system comprises a cutting cavity part, and the cutting cavity part comprises a material receiving plate, the upstream end of the waterproof armor is connected with the downstream end of the material receiving plate, and the waterproof armor and the material receiving plate can move synchronously. The water tank is used for receiving cutting chip liquid falling from the downstream end of the waterproof armor, the downstream end of the water tank is communicated with an inlet of the filtering cavity part, and the waterproof armor is arranged on the water tank in a back-and-forth sliding mode; and the first brush body is arranged at the downstream end of the waterproof armor, is located in the water tank and is driven by the waterproof armor to sweep the cutting chip liquid at the upstream end of the water tank into the inlet of the filtering cavity part, so that the technical effect that the cutting chip liquid can be timely and thoroughly guided to the filtering cavity part to be filtered is achieved.

Description

technical field [0001] The invention relates to the technical field of cutting, in particular to a slag water separation and collection system in a cutting cavity of a cutting machine and a dicing machine. Background technique [0002] In the process of semiconductor device processing, on the rectangular or circular surface, a plurality of parts are divided by horizontal and vertical grids (cut lines), and each part is an IC (integrated circuit) or LSI (Large Scale Integration) device. , and then cut along the cutting path to separate each part to make chips one by one. This kind of cutting equipment is also called precision grinding wheel cutting machine in China, hereinafter referred to as cutting machine. [0003] The cutting machine will inevitably generate a lot of waste during the cutting process. If it is not treated, it will cause pollution to the environment, so it is necessary to filter the waste. [0004] In the dicing machine of the prior art, the cutting water ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D7/00B28D5/02B01D35/02B01D29/56
CPCB28D5/0058B28D5/022B01D35/02B01D29/56Y02P70/10
Inventor 袁慧珠张明明
Owner 苏州和研精密科技有限公司
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