Super-resolution photoetching method based on two-color two-step absorption effect

A super-resolution and high-effect technology, which is applied in the direction of microlithography exposure equipment, photolithography exposure equipment, etc., can solve the problems of increasing system cost, expensive devices, and hindering popularization and application, so as to reduce the laser active area, increase the writing speed, The effect of reducing the line width of the engraved feature

Active Publication Date: 2022-07-22
ZHEJIANG LAB +1
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Problems solved by technology

However, two-photon lithography technology relies on femtosecond laser sources or picosecond laser sources, and high-energy pulses require matching optical lenses, pulse broadening correction and other devices are also very expensive, which also greatly increases the cost of the system
[0004] In a paper at the end of 2021, the Wegener research group of the Karlsruhe Institute of Technology in Germany proposed a method to achieve 3D processing capabilities using conventional light sources, which uses benzil photoinitiators combined with 405nm The conventional continuous light source realizes the preparation of three-dimensional structures, and the characteristic line width can reach less than 100 nanometers. However, the disadvantage is that the writing speed is very slow, which hinders the further popularization and application of this technology.

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  • Super-resolution photoetching method based on two-color two-step absorption effect
  • Super-resolution photoetching method based on two-color two-step absorption effect
  • Super-resolution photoetching method based on two-color two-step absorption effect

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Embodiment Construction

[0023] The present invention will be further described below through examples and accompanying drawings, but the protection scope of the present invention should not be limited by this.

[0024] A super-resolution lithography method based on two-color two-step absorption effect, such as figure 1 shown, including the following steps:

[0025] (1) Coat the photoresist containing benzil photoinitiator on the glass substrate or silicon substrate, and place it at the focal plane of the objective lens of the photolithography system;

[0026] (2) Turn on the first absorption beam and adjust its optical power density , incident into the photoresist;

[0027] (3) Turn on the second absorption beam and adjust its optical power density , incident into the photoresist, and adjust the focusing center of the second absorption beam to coincide with the focusing center of the first absorption beam;

[0028] (4) Move the focus center of the first absorption beam and the second absorption...

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Abstract

The invention discloses a super-resolution photoetching method based on a two-color two-step absorption effect, which comprises the following steps of: based on spectral absorption characteristics of a ground state and a triplet state of a benzil photoinitiator, jointly acting a laser beam with a wavelength in a ground state absorption range of a material and a laser beam with a wavelength in a triplet state absorption range of the other material in the material; the two-color two-step absorption effect is achieved by controlling the energy of the two, and the inscribing line width smaller than the diffraction limit is obtained by combining the relative displacement control of the two. The invention provides the super-resolution nano laser direct writing method with sub-hundred-nanometer inscribing precision and rapid inscribing capability, so that the three-dimensional photoetching direct writing technology has the advantages of high speed, super-resolution and complex structure inscribing capability.

Description

technical field [0001] The invention belongs to the field of super-resolution laser nanometer direct writing lithography, in particular to a super-resolution lithography method based on two-color double-step absorption effect. Background technique [0002] "If you want to do a good job, you must first sharpen your tools." As the foundation of a country's high-end manufacturing industry, micro-nano manufacturing technology can highlight a country's industrial development level. It plays an important role and is the key for a country to gain an advantage in international competition. However, at present, domestic high-end micro-nano manufacturing technologies, such as high-end industrial lithography machines for microelectronic chip manufacturing and high-end electron beam lithography equipment for scientific research, are monopolized by foreign companies. All need to spend a lot of money on these high-end processing equipment. Therefore, the development of my country's micr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/70325
Inventor 丁晨良匡翠方刘锡徐良杨臻垚孙秋媛沈小明
Owner ZHEJIANG LAB
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