Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Production process of heating decorative gypsum board

A production process and gypsum board technology, applied in lamination devices, layered products, lamination auxiliary operations, etc., can solve the problems of central heating and high use costs, and achieve the effects of low energy consumption, improved thermal insulation capacity, and high energy efficiency

Pending Publication Date: 2022-08-09
BEIJING NEW BUILDING MATERIALS PLC
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a production process for heating decorative gypsum board to solve the technical problems of high cost and centralized heating of traditional heating devices in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Production process of heating decorative gypsum board
  • Production process of heating decorative gypsum board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Taking cm as the length unit of the paper-faced gypsum substrate, the process of the invention is described in detail:

[0072] 1. Primary sawing treatment

[0073] (1) cutting and sawing the paper gypsum substrate into a plate-like structure with a length of 300 cm, a width of 100 cm and a thickness of 1.2 cm;

[0074] (2) Chamfer the long side of the paper-faced gypsum substrate, and the chamfering angle is 4*45°;

[0075] (3) Punch the peripheral edge of the paper gypsum substrate, the through hole is located at the peripheral edge of the paper gypsum substrate, the diameter of this through hole is 1.6cm, and the center of the nearest through hole is from the nearest paper gypsum substrate. The long side is 3.5cm, and the short side of the nearest gypsum board is 30cm;

[0076] (4) After the drilling is completed, clean the dust and burrs on the surface to obtain a pretreated substrate.

[0077] 2. Lamination of reflective film

[0078] (1) Glue spraying process:...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a production process of a heating decorative gypsum board. The production process comprises the following steps: S100, preparing a pretreated substrate; s200, spraying glue to the pretreated substrate for the first time, attaching a reflecting film to the pretreated substrate after glue spraying, and performing hot pressing for the first time to obtain a first substrate; s300, second glue spraying is conducted on the first substrate, the graphene electrothermal film is attached to the first substrate obtained after glue spraying, second hot pressing is conducted, and a second substrate is obtained; s400, third-time glue spraying is conducted on the second substrate, the protective film is attached to the second substrate obtained after glue spraying, third-time hot pressing is conducted, and a third substrate is obtained; and S500, fourth-time glue spraying is conducted on the third base plate, the facing layer is attached to the third base plate obtained after glue spraying, fourth-time hot pressing is conducted, and the heating decorative gypsum board is obtained. The heat preservation capacity of the gypsum board is improved, temperature rise is uniform, and use is safe; the energy efficiency is higher, the energy consumption is low, and the use cost is reduced.

Description

technical field [0001] The invention relates to the technical field of gypsum boards, in particular to a production process of a heating decorative gypsum board. Background technique [0002] Compared with ordinary brick-board structure houses, gypsum board is lighter in texture and easy to disassemble, and is a commonly used wall material for box-type houses. However, the thermal insulation effect of gypsum board is poor, especially in the cold winter, gypsum board often cannot achieve the effect of thermal insulation, resulting in a rapid drop in the temperature in the room, making the room extremely cold. In order to improve the comfort of the box-type room, indoor air conditioners are commonly used. , Oil Ting, heating furnace, etc. for heat preservation. [0003] These traditional heating devices have the defects of large power consumption, space occupation, high cost and low safety. The cost of air conditioners is high, and it is not conducive to installing on gypsum...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12B32B37/06B32B37/10B32B38/00B32B38/04B32B38/18
CPCB32B37/1284B32B37/06B32B37/10B32B38/0004B32B38/04B32B38/1858B32B2038/047Y02B30/00
Inventor 王兵刘明海赵铮董占波杨正波王洪波徐正东马琳李庆梦高玉柱蒋超张高攀周珊娣夏艳雪
Owner BEIJING NEW BUILDING MATERIALS PLC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com