Printing circuit layout method, printing circuit board and electronic device

Abstract

The invention relates to a printed circuit layout method, a printed circuit board, and an electronic device for reducing noise interference. On the two surface circuit layers of the circuit board, which belong to different corresponding positions, and where the components that should be more susceptible to radiation interference are located on the surface circuit layer, and are located inside at least one other layer of the printed circuit board Both the circuit layer and the other surface circuit layer form a ground plane area, and the ground plane area of ​​each circuit layer after lamination is conducted with a plurality of blind holes to connect each ground plane area with the ground plane above or below Area connection, thereby increasing the effect of its grounding area; therefore, through the above-mentioned design, it can effectively reduce the component that is more susceptible to radiation interference from the signal interference radiated by other components.

Description

technical field [0001] The present invention relates to a printed circuit layout method and a printed circuit board for reducing noise interference, especially for cooperating with and arranged in an electronic device to reduce mutual noise interference between components inside the electronic device, so as to improve the performance of the electronic device and the effect of receiving signals. Background technique [0002] At present, personal portable electronic devices are becoming more and more popular in the market. All kinds of personal portable electronic products, such as personal digital processors, stock financial machines, digital cameras, palmtop computers and smart phones, all have functions and Striving for breakthrough and perfection in modeling, in order to win the favor of consumers and promote the growth of performance. [0003] Among them, the printed circuit board (PCB) will appear in almost every electronic device. In addition to fixing various elec...

AI Technical Summary

Problems solved by technology

Although electronic products are developing vigorously at present, when such electronic products are in use, the electromagnetic environment will deteriorate even more when the radiation is not increased, which will inevitably lead to mutual interference between electronic components in electronic equipment and lead to The problem of performance reduction, the confusion of the displayed screen, and the uncontrollable operating system of the aircraft and other social problems; some of the R&D personnel of manufacturers and companies consider the market demands of miniaturization, thinning, and light weight of electronic products, and in PCB In addition to using multi-layer boards to increase the area that can be wired, the layout of the PCB may also try to arrange electronic components on the same side of the PCB to reduce the thickness of the entire PCB and reduce the internal space of the electronic products it occupies. ; Or in the layout of the PCB, the electronic components are not considered to be related to each other and placed in the same area. Therefore, some sensitive and easily disturbed components (such as: antenna or signal amplification circuit) etc.) will receive some interference from unknown radiation signals, resulting in misinterpretation or poor performance; however, some noise interference comes from certain components on the PCB, making the components in the electronic device often interfere with each other For this reason, the noise limit must be strengthened in terms of radiation intensity and the range of applicable products. Manufacturers and companies must pass such restrictions, design, simulation prediction technology, etc., to map the EMC performance of products. Improvement; while EMC aims at the coexistence of EMI (output noise side) and anti-interference (receiving noise side) electromagnetic environment

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