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Perfluorinated hydrocarbon polymer-filled adhesive formulations and use thereof

A perfluorinated hydrocarbon and binder technology, used in non-polymeric organic compound binders, adhesives, semiconductor/solid-state device parts and other directions to achieve good rheological effects

Inactive Publication Date: 2007-02-07
QUANTUM MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But these materials do not give good rheology to the viscose made from them

Method used

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  • Perfluorinated hydrocarbon polymer-filled adhesive formulations and use thereof
  • Perfluorinated hydrocarbon polymer-filled adhesive formulations and use thereof
  • Perfluorinated hydrocarbon polymer-filled adhesive formulations and use thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0125] Prepare the viscose composition by thoroughly mixing the Teflon powder and the thermosetting resin carrier in a bowl. The resin carrier that adopts is made up of following composition (percentage by weight):

[0126] 60% 1,20-bismaleimido-10,11 dioctyl-eicosane (BMI, see USSN 08 / 300,721 and 08 / 460,495, both of which are hereby incorporated by reference) ,

[0127] 13.0% Ricon 130MA-20 (available from Ricon Resins, Inc., Grand Junction, CO),

[0128] 22.0% 1-vinyloxy-2-decyltetradecane (see USSN 08 / 300,721 and 08 / 460,495, both of which are hereby incorporated by reference),

[0129] 1.0% USP90MD (a peroxide catalyst available from Witco Corporation, Argus Division, Marshall, TX), and

[0130] 3% Silquest A-186 plus 1% Silquest A-174 (coupling agents both available from OSI Specialities, Inc., South Charleston, WV).

[0131]The Teflon powder used was DuPont's product 1600N (available from DuPont Fluroproducts, Wilmington, DE). 40% by weight of this filler was mixed i...

example 2

[0135] A second viscose composition was prepared as outlined in Example 1. The same resin carrier and Teflon filler were used. But this time the composition was formulated to contain 45% by weight filler. The resulting viscose had a Brookfield 10 rpm viscosity of 24,490 centipoise and a 1 / 20 thixotropic index of 13.53.

[0136] The silicon chip was then attached to the silver plated copper lead frame as described in Example 1 using the adhesive prepared above. The cured part had an average room temperature die shear of 15.47 kgf and a hot (ie, 245°C) die shear of 4.08 kgf.

[0137] A thermal analysis of the viscose was additionally carried out. The TGA (thermogravimetric analysis) method measured a weight loss of 2.69% at 250°C. According to the DSC (differential scanning calorimetry) method, the maximum value of the temperature rise was 128.0°C.

example 3

[0139] A third viscose composition was prepared following the procedure described in Example 1. The same resin carrier and Teflon filler were used. But the weight percent of filler is reduced to 35% by weight of the composition. The resulting viscose had a Brookfield 10 rpm viscosity of 7332 centipoise and a 1 / 20 thixotropic index of 6.96.

[0140] The silicon chip was then attached to the silver plated copper lead frame as described in Example 1 using the adhesive prepared above. The cured part had an average room temperature die shear of 14.30 kgf and a hot (ie, 245°C) die shear of 4.01 kgf.

[0141] Thermal analysis of the viscose was carried out as outlined in Example 1. The TGA (thermogravimetric analysis) method measured a weight loss of 2.77% at 250°C. According to the DSC (differential scanning calorimetry) method, the maximum temperature rise was 128.17°C.

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Abstract

In accordance with the present invention, it has been discovered that perfluorinated hydrocarbon polymers can be used as fillers for the preparation of adhesive formulations having excellent dielectric properties, i.e., very low conductivities. Invention compositions display excellent rheological properties, in addition to low dielectric constants. Invention formulations can be used for a variety of purposes, such as, for example, for the preparations of filled adhesive formulations with a reduced propensity to settle out, excellent dispensing characteristics due to the dixotropic nature thereof, and the like.

Description

field of invention [0001] The present invention relates to adhesives and their use. In a particular aspect, the invention relates to filled binders having excellent insulating properties, ie very low electrical conductivity. In another aspect, the invention relates to perfluorinated hydrocarbon polymer filled binders. Background of the invention [0002] Electrically insulating adhesives have many potential uses. But this material must meet the composite criteria, that is, in addition to having a low dielectric constant, this material must also have good dispensability and good adhesion. Non-conductive fillers commonly used to prepare electrically insulating adhesives include aluminum nitride, boron nitride, alumina, silica, and the like. However, these materials do not allow good rheological properties of the viscose prepared therefrom. [0003] The rheology of the adhesive is an important manufacturing consideration. For example, the separat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F259/08C09J4/06C09J183/04C08L51/06C08F220/00C08F226/00C09J4/00C09J183/07H01L21/52H01L23/29H01L23/31
CPCC09J4/06C08F259/08C09J183/04C08L2666/04C08F259/00
Inventor 斯蒂芬·M·德谢姆代博赫·D·福雷
Owner QUANTUM MATERIALS
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