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Leadless solder and manufacture method thereof

A technology of lead-free solder and manufacturing method, which is applied in the field of lead-free solder and lead-free tin solder, and can solve the problems of high melting point, complicated process and high cost

Inactive Publication Date: 2007-02-21
郴州金箭焊料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the rapid development of the electronic industry, the requirements for electronic products are getting higher and higher. There are many types of solder used in electronic products, but most of them still use tin-lead alloy solder. Because the lead in tin-lead solder pollutes the environment, so The European Union issued two directives to prohibit the use of lead-containing tin solder in electronic products from July 1, 2006. Most of the existing lead-free solders are tin-silver, tin-copper, tin-silver-copper, tin- It is composed of zinc-indium-bismuth, tin-antimony-silver-indium, tin-zinc-nickel, etc., and a few are composed of tin-silver-mixed rare earths. The disadvantage of the above-mentioned lead-free tin solder is that it has a melting point High, some have low wettability, some have coarse crystals, and some have many components and complex processes and high costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Put 96kg of refined tin containing 99.95% tin and 4kg of metal cerium containing 99.99% cerium into the crucible, put it into a vacuum melting furnace for melting, raise the temperature to 1000°C, keep it warm for 2 hours, stir for 30 minutes, take it out of the furnace, cool and cast it into 4% cerium 70kg of refined tin containing 99.95% of tin and 30kg of silver ingot containing 99.99% of silver are added to the crucible and placed in an intermediate frequency furnace for melting, vacuumized and filled with nitrogen, heated to 1200°C, kept for 3 hours, taken out of the furnace, cooled and cast 70kg of refined tin containing 99.95% of tin and 30kg of refined copper containing 99.95% of copper are added to the crucible and put into an intermediate frequency furnace for melting, vacuumized and filled with nitrogen, heated to 900°C, and kept for 3 hour, out of the furnace, cooled and cast into a tin-copper master alloy ingot containing 30% copper; get the above-mentioned ...

Embodiment 2

[0039] Manufacture three kinds of intermediate alloys by the method for embodiment 1, get tin-cerium alloy ingot 0.25kg, tin-silver alloy ingot 16.7kg, tin-copper alloy ingot 1.67kg and add the insufficient tin amount of surplus tin 81.38kg, add manganese alloy smelting The pot is melted and cast into a lead-free solder bar to obtain the lead-free solder product of the present invention made of 0.01% cerium, 5.0% silver, 0.5% copper and 94.49% tin as raw materials.

Embodiment 3

[0041] Manufacture three kinds of master alloys by the method for embodiment 1, get 1.25kg of tin-cerium alloy ingot, 13.33kg of tin-silver alloy ingot, 3.33kg of tin-copper alloy ingot and the insufficient tin amount 82.09kg of adding surplus tin, add manganese alloy smelting The pot is smelted and cast into a lead-free solder bar to obtain the lead-free solder product of the present invention made of 0.05% cerium, 4.0% silver, 1.0% copper and 94.95% tin as raw materials.

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PUM

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Abstract

The present invention relates to solder without lead, particular solder contained copper, silver and cerium and without lead and tin, and characterized in that, smelt refined tin, cerium, silver ingot, and refined copper; cast tin-cerium intermediate alloy ingot with cerium 4%, tin-silver intermediate alloy ingot with silver 30% and tin-copper intermediate alloy ingot with copper 30%; add three alloy ingots into manganese alloy pan and put into MF furnace for fusion to cast into solder bar and obtain the product. It is with high purity, low metal loss, even metallic phase, and more finely; it increases wettability, elongation and welding performance; decrease melting point, improves welding spot shearing force, tension force and QFP lead wire 45Deg tension force of chip component; good quality and benefit to environmental protection.

Description

technical field [0001] The invention relates to a lead-free solder, in particular to a lead-free tin solder containing copper, silver and cerium, belonging to the field of tin solder alloys. [0002] The present invention relates to a manufacturing method of the lead-free solder. Background technique [0003] With the rapid development of the electronic industry, the requirements for electronic products are getting higher and higher. There are many types of solder used in electronic products, but most of them still use tin-lead alloy solder. Because the lead in tin-lead solder pollutes the environment, so The European Union issued two directives to prohibit the use of lead-containing tin solder in electronic products from July 1, 2006. Most of the existing lead-free solders are tin-silver, tin-copper, tin-silver-copper, tin- It is composed of zinc-indium-bismuth, tin-antimony-silver-indium, tin-zinc-nickel, etc., and a few are composed of tin-silver-mixed rare earths. The d...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/02
Inventor 邓和升罗时中杨增安胡智信杨嘉骥顾小龙陈颖苏明斌戴国水吴建雄
Owner 郴州金箭焊料有限公司
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