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Magnetron sputtering vacuum plating silver process for soft-magnetic ferrite core

A soft ferrite, magnetron sputtering technology, applied in sputtering coating, vacuum evaporation coating, ion implantation coating and other directions, can solve the problems of waste materials, environmental impact, etc., to achieve the effect of saving raw materials

Active Publication Date: 2007-08-22
广州今泰科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the silver-plated conductive electrodes of soft ferrite cores in use in China are all using chemical plating, which has a great impact on the environment.
Moreover, the thickness of the coating is generally 20-30 microns, which is a waste of material, and the ability to resist high-temperature soldering at 420°C does not exceed 3 minutes

Method used

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  • Magnetron sputtering vacuum plating silver process for soft-magnetic ferrite core

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Clamp a magnetic core and place it in a multi-target magnetron sputtering coating machine, and evacuate to a vacuum degree of 10 -2 , heated to 200°C;

[0024] Target ① is used to bombard the magnetic core with ions, and the argon pressure in the vacuum furnace is 6×10 -1 Pa, negative bias 300V;

[0025] Use target ① to deposit 0.5 micron, negative bias voltage 80V, argon pressure in vacuum furnace 6×10 -1 Pa.

[0026] The stainless steel film layer and the silver film layer are alternately coated, and the film thickness is 1.5 microns. Then gradually reduce the deposition of stainless steel material. Negative bias voltage 50V, argon pressure in vacuum furnace 6×10 -1 Pa.

[0027] Plating pure silver 5 microns, negative bias 50V, argon pressure in vacuum furnace 6×10 -1 Pa.

[0028] Plated with sterling silver 0.5 microns. Negative bias voltage 0V, argon pressure in vacuum furnace 6×10 -1 Pa.

[0029] The soft ferrite core obtained in this embodiment is teste...

Embodiment 2

[0031] Clamp a magnetic core and place it in a multi-target magnetron sputtering coating machine, and evacuate to a vacuum degree of 1.5×10 -2 Pa, heated to 250°C;

[0032] Target ① is used to bombard the magnetic core with ions, and the argon pressure in the vacuum furnace is 4×10 -1 Pa, negative bias 350V;

[0033] Use target ① to deposit 0.8 micron, negative bias voltage 70V, argon pressure in vacuum furnace 4×10 -1 Pa.

[0034] The stainless steel film layer and the silver film layer are alternately coated, and the film thickness is 1 micron. Then gradually reduce the deposition of stainless steel material. Negative bias voltage 70V, argon pressure in vacuum furnace 4×10 -1 Pa.

[0035] Plating pure silver 4 microns, negative bias voltage 70V, argon pressure in vacuum furnace 4×10 -1 Pa.

[0036] Plated with sterling silver 0.7 microns. Negative bias voltage 0V, argon pressure in vacuum furnace 4×10 -1 Pa.

[0037] The soft ferrite core obtained in this embodime...

Embodiment 3

[0039] Clamp a magnetic core and place it in a multi-target magnetron sputtering coating machine, and evacuate to a vacuum degree of 1.5×10 -2 Pa, heated to 300°C;

[0040] Target ① is used to bombard the magnetic core with ions, and the argon pressure in the vacuum furnace is 2×10 -1 Pa, negative bias 400V;

[0041] Use target ① to deposit 1 micron, negative bias voltage 80V, argon pressure in vacuum furnace 2×10 -1 Pa.

[0042] The stainless steel film layer and the silver film layer are alternately coated, and the film thickness is 2 microns. Then gradually reduce the deposition of stainless steel material. Negative bias voltage 80V, argon pressure in vacuum furnace 2×10 -1 Pa.

[0043] Plating pure silver 3 microns, negative bias voltage 80V, argon pressure in vacuum furnace 2×10 -1 Pa.

[0044] Plated with sterling silver 1 micron. Negative bias voltage 0V, argon pressure in vacuum furnace 2×10 -1 Pa.

[0045] The soft ferrite core obtained in this embodiment i...

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Abstract

The invention involves a kind of soft magnetism ferrite core magnetism to control the sputtering vacuum silver-plating craft. Including following step: Carries on in negative bias 300-400V with the stainless steel target material to the soft magnetism ferrite core shells the clean: Plates the transitional layer 0.5-1 micron in negative bias 50-80V with the stainless steel target material to the soft magnetism ferrite core; Plates the stainless steel membrane level and the silver membrane level in negative bias 50-80V, the membrane is thick is 1-2 micron in turn; Plates the pure silver membrane level 3-5 micron in negative bias 50-80V; Plates the pure silver membrane level 0.5-1 micron in negative bias 0V. The soft magnetism ferrite core after this craft deposition silver electrode, the membrane depth 5-8 micron, compares chemistry method 20-30 micron coating thickness greatly to save the raw material, can the anti- 420 DEG C tin stove weld above 4 minutes, but 90% silver electrode still might weld.

Description

technical field [0001] The invention relates to a soft magnetic ferrite core magnetron sputtering vacuum silver plating method. Background technique [0002] At present, the silver-plated conductive electrodes of soft magnetic ferrite cores in use in China all adopt the method of chemical plating, which has a great impact on the environment. Moreover, the thickness of the coating is generally 20-30 microns, which is a waste of material, and the ability to resist high-temperature soldering at 420°C does not exceed 3 minutes. Contents of the invention [0003] The object of the present invention is to overcome the disadvantages of the prior art, and provide a soft ferrite core silver plating method which saves materials and has no pollution to the environment. [0004] The technical solution of the present invention is: a kind of magnetron sputtering vacuum silver-plating method of soft magnetic ferrite magnetic core, firstly soft magnetic ferrite magnetic core is placed in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C23C14/14
Inventor 蔡育平
Owner 广州今泰科技股份有限公司