Polyamide resin compsns.

A technology of polyamide resin and composition, which is applied in the field of polyamide resin composition and its molded products, and can solve the problems of poor compatibility between semi-aromatic polyamide and polybrominated styrene, poor chemical resistance, surface peeling, etc.

Inactive Publication Date: 2002-04-10
KURARAY CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the semi-aromatic polyamide resin composition containing such polybromostyrene, the compatibility of semi-aromatic polyamide and polybromostyrene is poor, so the flame retardant polybromostyrene cannot be well dispersed in resin composition
As a

Method used

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  • Polyamide resin compsns.

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Experimental program
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Effect test

Embodiment 1-5

[0057] The above-mentioned polyamide resin was mixed with polybromostyrene (hereinafter referred to as "GMA-PBrS") containing 2.0 mol% glycidyl methacrylate, polybromostyrene (PBS-64 of Great Lakes Chemical, hereinafter referred to as "PBrS"), zinc borate (Borax's Fire Break 415), a mixture of sodium oxide and antimony pentoxide (Nissan Chemical's Sun-EpocNA-1070L), zinc stannate (Nippon Light Metal's FLAMTARD-S), and glass fiber (Nitto Boseki's CS-3J-256S) was premixed in the proportions shown in Table 1 below. The resulting mixture was fed into a twin-screw extruder (TEX44C by Nippon Seikosho), kneaded and extruded in a molten state at a barrel temperature of 320° C., then cooled and cut into pelletized polyamide resin compositions. The pellets were molded in an injection molding machine (barrel temperature 330°C, molding temperature 150°C), and the resulting molded articles were examined as described above. The test results are shown in Table 1. Comparative example 1-2

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Abstract

A polyamide resin composition is provided, which contains 100 parts by weight of a polyamide resin (A) that has dicarboxylic acid units (a) containing from 60 to 100 mol% of terephthalic acid units and diamine units (b) containing from 60 to 100 mol% of C6-18 aliphatic alkylenediamine units, and from 1 to 100 parts by weight of a polybromostyrene (B), in which from 0.5 to 100% by weight of the polybromostyrene (B) is a polybromostyrene having an epoxy group. The polyamide resin composition has good flame retardancy, good chemical resistance, good surface appearance and good blistering resistance.

Description

technical field [0001] The present invention relates to a polyamide resin composition and its molded articles. The polyamide resin composition of the present invention has good flame retardancy, good chemical resistance, good surface appearance and good anti-foaming properties, therefore, people are willing to use it in applications requiring flame retardancy and good mechanical properties fields, such as industrial materials, engineering materials, household appliances, electrical and electronic appliance components, automotive parts, etc. Background technique [0002] Aliphatic polyamides such as Nylon 6 and Nylon 66 are commonly used in engineering plastics because of their good heat resistance, good chemical resistance, high stiffness, good abrasion resistance and good moldability. In the electrical and electronic fields, engineering plastics are required to have high flame retardancy. Therefore, various methods of imparting flame retardancy to engineering plastics usin...

Claims

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Application Information

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IPC IPC(8): C08L25/18C08L77/00C08L77/02C08L77/06
CPCC08L25/18C08L77/02C08L77/00C08L77/06C08L25/00
Inventor 松冈秀治冈秀明佐佐木繁
Owner KURARAY CO LTD
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