Resin shaping block
A technology of resin moldings and resins, applied in semiconductor devices, electrical solid devices, dielectric properties, etc., can solve problems such as the surface and metal layer adhesion effect of difficult resin moldings
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Embodiment approach
[0024] The resin molded article of the present invention is formed by forming a resin composition blended with a rubber elastic body on a base resin composed of a thermoplastic resin or a thermosetting resin. The thermoplastic resin or thermosetting resin used as the base resin is not particularly limited, but it is particularly preferred to have at least any one of an amide bond, a thioether group, and an amino group, and it is also preferred to have a sulfonic acid group, a ketone group, an imine group At least any one of an epoxy group, an epoxy group, and a thiol group is preferable. As having an amide bond, nylon 6 (PA6), nylon 66 (PA66), PA-MXD-6, aromatic polyamide (polyphthalamide: PA6T, PA9T) etc. are mentioned; Those having an ether group include polyphenylene sulfide resin (PPS), and those having an amino group include polyether nitrile (PEN), ABS, and the like. In addition, polysulfone (PSF), polyethersulfone (PES) and the like can be mentioned as having a sulfoni...
Embodiment 1
[0069]The aforementioned PPA was used as the base resin, and the aforementioned A3 parts by mass as a rubber-like elastic body was blended with 100 parts by mass of the base resin. The above-mentioned formulation was melt-kneaded at a screw speed of 150 rpm using a twin-screw screw device with a diameter of 25 mm and L / D=25, and the obtained product was cooled and pelletized to prepare a resin composition. Then, by injection molding this resin composition, a resin molded body was obtained.
[0070] Then, the surface of the resin molded body was treated with plasma, and a metal layer was formed by thermal spraying. That is to say, the resin molded body is first contained in the container of the plasma processing apparatus, and the container is evacuated and depressurized to 10 -4 After about Pa, the active gas nitrogen is introduced into the container and circulated, while controlling the pressure in the container to 10Pa. Thereafter, a high-frequency voltage (RF: 13.56 MHz) ...
Embodiment 2-7、 comparative example 4、6
[0073] The base resins shown in Table 1 were used respectively, and the rubber-like elastic bodies shown in Table 1 were blended in the ratios shown in Table 1 to 100 parts by mass of the base resin. This compound was kneaded by the same method as Example 1, and the resin composition was prepared. A resin molded body was formed from this resin composition in the same manner as in Example 1, and a metal layer was further formed on the surface of the resin molded body.
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Abstract
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