Process for producing polyester film

A manufacturing method and polyester film technology, applied in printed circuit manufacturing, multi-layer circuit manufacturing, electrical components, etc., can solve the problems of equipment investment, epoxy resin denaturation, increase in processing procedures, etc., and achieve accurate manufacturing plate thickness accuracy. Effect

Inactive Publication Date: 2002-10-16
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, although the generation of resin powder from the prepreg is prevented, the denaturation of the epoxy resin is caused by melting, and there are problems such as requiring investment in equipment and increasing the number of processing steps.

Method used

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  • Process for producing polyester film
  • Process for producing polyester film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] use figure 1 The polyester film manufacturing device shown is made of a polyester film composed of an inner layer impregnated with epoxy resin in a commercially available glass fiber woven cloth and an outer layer coated with epoxy resin on both sides of the inner layer. film.

[0031] In 100 parts by weight of methyl ethyl ketone, 70 parts by weight of a bisphenol A epoxy resin having an epoxy equivalent of about 450 and 30 parts by weight of a novolac epoxy resin with an epoxy equivalent of about 190 were dissolved. Add the solution of dissolving 3 parts by weight of dicyandiamide and 0.15 parts by weight of 2-phenol-4-methylimidazole in 20 parts by weight of dimethylformamide to this solution, stir and mix, and prepare the epoxy resin for glass weaving Varnish (I).

[0032] 35 parts by weight of bisphenol A type epoxy resin of about 450 epoxy equivalents, 35 parts by weight of bisphenol A type epoxy resins of about 2000 of epoxy equivalents, and about 210 of ep...

Embodiment 2

[0037] Except that the epoxy resin varnish (I) is replaced in the (d) process, and the epoxy resin varnish (II) is used to form the outer layer b, the rest are the same as in Example 1, and the inner layer a and the inner layer A prepreg consisting of an outer layer b formed on both sides of layer a. As a result, the reaction rate of the inner layer a was 86%, and that of the outer layer b was 52%. Comparative example 1

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PUM

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Abstract

The invention provides a method for producing a polyester film, the method sequentially carries out (a) the process of immersing the glass fiber matrix material in a solvent; (b) the process of immersing the glass fiber matrix material impregnated with the solvent in an epoxy resin; (c) the process of heating the glass fiber matrix material impregnated with epoxy resin; (d) the process of further impregnating the glass fiber matrix material impregnated and cured with epoxy resin in epoxy resin; (e) heating the impregnated The glass fiber matrix material process of epoxy resin, the reaction rate of the inner layer epoxy resin is more than 85%, and the reaction rate of the outer layer epoxy resin is less than 60%. As a result, the laminated board or multilayer circuit board after molding has excellent board thickness accuracy, and a prepreg film excellent in formability can be stably and reliably produced.

Description

technical field [0001] The present invention relates to a method for producing a high-quality prepreg with high plate thickness accuracy, excellent formability, and less shedding of resin powder. The prepreg obtained by the present invention can be suitably used, for example, as a substrate of a cellular phone, a personal computer, an operating bus memory, a PDA, etc., which require high-frequency characteristics. Background technique [0002] In recent years, laminated boards for circuit boards and multilayer circuit boards have used higher frequencies than before, and the requirements for the physical properties of their materials have become stricter. In particular, research has been conducted on circuit board materials for signal delay in circuits, and resins with controlled impedance have been developed by lowering the dielectric constant of circuit boards and improving the accuracy of board thickness after board molding. Since the plate thickness accuracy of the subst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C70/50C08J3/24C08J5/24H05K1/03H05K3/46
CPCC08J3/245C08J2363/00H05K1/0366H05K2203/0783H05K2203/1476C08J5/244B29C70/50
Inventor 山地贵志小松守
Owner SUMITOMO BAKELITE CO LTD
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