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Process for preparing high-performance Ni-P alloy solution for chemical plating

A technology of electroless nickel plating and alloy solution, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of poor corrosion resistance of the coating, damage to the composition of the plating solution, and easy self-decomposition of the plating solution. , to achieve the effect of excellent corrosion resistance and good stability

Inactive Publication Date: 2003-02-12
郭福春 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing plating solution shows the following disadvantages during use: 1. The stability is not ideal, that is, under the no-load condition of boiling at 100°C, the plating solution is prone to self-decomposition and the composition of the plating solution is destroyed
2. The corrosion resistance of the coating is poor, that is, black spots appear on the coating after soaking in nitric acid for 10 to 100 seconds
3. The thickness of the plating layer is generally less than 150 μm, and the existing plating solution has not shown good stability and corrosion resistance, which needs further improvement

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0006] Embodiment 1: take the following items and add water to dissolve and make 1 liter of aqueous solution, nickel sulfate 27g, sodium hypophosphite 30g, sodium edetate 10g, citric acid 1.1g, lactic acid 10g, malic acid 3g, succinic acid 10g, Boric acid 14g, sodium acetate 10g, sodium thiocyanate 0.011g, ammonium molybdate 0.001g, lead nitrate 0.005g. The pH value of the prepared solution was 4.6, and the use temperature was 86°C. The plating speed of the solution is fast and stable, and the plating density is good.

Embodiment 2

[0007] Embodiment 2: Take the following items and dissolve in water to make 1 liter of aqueous solution, nickel sulfate 20g, sodium hypophosphite 15g, sodium edetate 1.5g, citric acid 2.2g, lactic acid 5g, malic acid 4g, succinic acid 30g , boric acid 6g, sodium acetate 20g, sodium thiocyanate 0.04g, ammonium molybdate 0.002g, lead nitrate 0.001g. The pH value of the prepared solution was 4.8, and the use temperature was 88°C. The plating layer of the solution is bright, compact and has good anti-corrosion performance.

Embodiment 3

[0008] Embodiment 3: take the following items and dissolve in water to make 1 liter of aqueous solution, nickel sulfate 24g, sodium hypophosphite 27g, sodium edetate 1g, citric acid 15g, lactic acid 7g, malic acid 3g, succinic acid 28g, boric acid 7g, 40g of sodium acetate, 0.01g of sodium thiocyanate, 0.0013g of ammonium molybdate, and 0.002g of lead nitrate. The pH value of the prepared solution was 4.6, and the use temperature was 90°C. The plating layer of the solution is bright and has good corrosion resistance.

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Abstract

A high-performance soloution for chemical plating of Ni-P alloy contains primary salt (nickel sulfate and sodium hypophosphite), composite complexing agent (complexon, citric acid, lactic acid, sterculic acid and butanedioic acid), composite buffer (boric acid and sodium acetate), and composite stabilizer (sodium thiocyanate, ammonium mobybdenate and lead nitrate). Its advantages are high stability and high anticorrosion performance of its plated layer; and the plated layer can be applied with secondary plating.

Description

technical field [0001] The invention relates to a preparation method of a high-performance electroless nickel-phosphorus alloy solution. It belongs to the preparation technology of non-electrolytic plating solution. Background technique [0002] Electroless nickel plating is a metal surface alloy treatment technology. The plating solution used is mainly composed of main salt and stabilizer. The main salts include nickel sulfate and sodium hypophosphite, and the stabilizers include single-component or two-component citric acid, malic acid, and lactic acid. The existing plating solution shows the following disadvantages during use: 1. The stability is not ideal, that is, under the no-load condition of boiling at 100°C, the plating solution is prone to self-decomposition and the components of the plating solution are destroyed. 2. The corrosion resistance of the coating is poor, that is, black spots appear on the coating after soaking in nitri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36
Inventor 郭福春胡静
Owner 郭福春
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