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Electronic device and process of making electronic device

An electronic device and device technology, applied in the field of multi-layer electronic devices, can solve the problems of time-consuming, expensive, difficult, etc., and achieve the effect of avoiding selective removal

Inactive Publication Date: 2003-05-28
AVX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Resin coating, where resin is subsequently selectively removed from only specific portions of the microelectronic device, is a difficult, time-consuming and expensive endeavor

Method used

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  • Electronic device and process of making electronic device
  • Electronic device and process of making electronic device
  • Electronic device and process of making electronic device

Examples

Experimental program
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Effect test

example 1

[0059] In the application of the present invention, electronic devices are fabricated, cut and sintered using methods known to those skilled in the art. The terminals on the electronic device are then formed by first applying a silver / glass frit paste. The terminals are then fired onto the device.

[0060] An advantageous method of applying the resin is by CYCLOTENE  Use CYCLOTENE at a dilution ratio of 1:10 to solvent  3022-35. CYCLOTENE  3022-35 is a Class B butadienesiloxane-bisbenzocyclobutene with polymerized 1,2-dihydro-2,2,4-trimethylquinoline. The solvent used was T1100-mesitylene (1,3,5-trimethylbenzene), which is available from DOW Corporation. The BCB concentration was 35%. The device is prepared for full immersion in resin and vacuum infusion of resin. After immersion the excess CYCLOTENE  Centrifugation from electronics, as further described below. Then, the resin coating was cured at about 250° C. for about 1 hour in a nitrogen atmosphere. After coa...

example 2

[0062] In another embodiment of the invention, different resins may be used. Electronic devices were first fabricated, cut and sintered using standard methods described in Example 1, as described above. The terminals on the electronic device are then formed by first applying a silver / glass frit paste. The terminals are then fired onto the device.

[0063] Using essentially the same method as described in Example 1, apply THERMID  coating. THERMID  is a polyimide oligomer compound for terminals manufactured and sold by National Starch and Chemical Co. of Bridgewater, New Jersey. THERMID  is a registered trademark of National Starch and Chemical Company.

example 3

[0065] In yet another embodiment of the invention, different resins may be used. Electronic devices were first fabricated, cut and sintered using the method described in Example 1, as described above. The terminals on the electronic device are then formed by first applying a silver / glass frit paste. The terminals are then fired onto the device.

[0066] Then utilize substantially the same method as described in example 1, coat the resin FLARE that Raychem, AlliedSignal Company sells  . ("FLARE" is a trademark of Raychem, an Allied Signal Company of Menlo Park, CA 94025). FLARE  It is a low dielectric constant, non-moisture sensitive, non-polyimide based polymer film dielectric material. The dielectric constant of FLARE increased from 2.62 at 0% RH to 2.66 at 60% RH. FLARE  The brand name polymer is fluorinated poly(aryl ether). For a description of the properties and applications of FLARE, see the article "Multichip Module Made From FLARE" by Horsma and Mercer publi...

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Abstract

An electronic device and process of making the device is disclosed. The device includes a multi-sided body defined by a plurality of electrode plates arranged in a stack. A resin layer is applied to both conductive and semiconductive regions of the device, and metal is plated upon terminals to create a conductive element. The device may be a varistor, themistor, resistor, or other microelectronic component having a multi-sided body and terminal structures that are capable of receiving a resin coating. The multi-sided body has a resin coating on at least a portion of an exterior surface, the resin coating substantially preventing plating of metal onto the exterior surface of the body. One suitable resin coating that may be employed is a thermoset resin comprising a B-staged divinylsiloxane-bis(benzocyclobutene)(i.e. ''BCB'') resin dissolved in mesitylene solvent.

Description

[0001] Related Application Citations [0002] This patent claims priority to Patent Application US 60 / 193276, filed March 30, 2000, as a provisional patent application entitled "Electronic Devices and Methods of Making Electronic Devices"; and also filed March 16, 2001 Priority is claimed to a U.S. conventional utility model application with unknown serial number, entitled "Electronic Device and Method of Making an Electronic Device." technical field [0003] The present invention generally relates to multilayer electronic devices for use in the electronics industry. Background technique [0004] Manufacturing small electronic components - such as varistors, resistors, thermistors, etc. - requires many processing steps. Several different methods are used to produce devices that can store electrical energy on circuit boards. After fabricating microelectronic devices, manufacturers use soldering methods to attach such devices to circuit boards at high speed. [0005] When s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/00H01C1/028H01C1/142H01C7/04H01C7/10H01C17/28H01G2/12
CPCH01C17/288H01C1/142H01G2/12H01C1/028Y10T29/49082
Inventor 罗伯特·H·海斯坦第二约翰·L·高尔瓦格尼杰弗里·P·梅维森罗伯特·M·肯尼迪第三
Owner AVX CORP