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Method for preparing tungsten-copper base composite powder and sintered alloy made up by using said composite powder for making radiator

A copper-based composite and powder technology, used in tungsten compounds, chemical instruments and methods, transportation and packaging, etc.

Inactive Publication Date: 2003-07-09
KOREA INST OF MACHINERY & MATERIALS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this ease may cause voids to form between aggregates, and thus the sintered body cannot be sufficiently densified

Method used

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  • Method for preparing tungsten-copper base composite powder and sintered alloy made up by using said composite powder for making radiator
  • Method for preparing tungsten-copper base composite powder and sintered alloy made up by using said composite powder for making radiator
  • Method for preparing tungsten-copper base composite powder and sintered alloy made up by using said composite powder for making radiator

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[0020] The method for preparing tungsten-copper matrix composite powder of the present invention is characterized in that the electrical conductivity and thermal conductivity of the sintered alloy prepared therein are substantially improved, wherein the method comprises: dissolving water-soluble tungsten salt and copper-containing salt A homogeneous mixture of tungsten and copper that does not have solid solubility and a large difference in specific gravity is formed in water, the composite oxide powder is calcined, and the calcined composite oxide powder is mixed with tungsten obtained by an additional calcining process at an appropriate ratio. Another tungsten oxide is mixed, and the mixed powder obtained by the above method is reduced.

[0021] Methods for preparing the tungsten-copper based material of the present invention are the following two methods. A method comprising: compacting the reduced composite powder produced by the method described above; and sintering the c...

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Abstract

The present invention relates to a method of producing W-Cu based composite powder, which is used in heat-sink materials for high-power integrated circuits, electric contact materials, etc, and to a method of producing a W-Cu based sintered alloy by using the composite powder. The method of producing tungsten-copper based composite powder includes first preparing composite oxide powder by dissolving ammonium metatungstate, [(NH4)6(H2W12O40).4H2O], as water-soluble tungsten salt, and copper nitrate or copper acetate in water to the desirable composition, followed by spray-drying and calcining; then preparing a tungsten oxide powder by separately calcining a tungsten-containing salt, such as ammonium paratungstate, (NH4)10(H10W12O46); forming ultra-fine tungsten-copper based composite oxide powder by mixing 20~75wt % of the composite oxide powder and 80~25wt % of the tungsten oxide powder to the desirable composition, followed by ball-milling; and reducing the ultra-fine tungsten-copper based composite oxide powder at temperature of 650~1,050 DEG C. If the composite powder is molded into a certain size and sintered thereafter in temperature of 1,110~1,450 DEG C., a W-Cu based sintered alloy of superior thermal and electric conductivities can be obtained thereby.

Description

technical field [0001] The present invention relates to a method for preparing W-Cu-based composite powder, which is used in heat sink materials for high-power integrated circuits, electrical contact materials, etc., and to a method for preparing W-Cu-based sintered alloys by using the composite powder method. Background technique [0002] W-Cu-based composite sintered alloys composed of tungsten particles and copper matrix are used as materials for high-voltage contacts and electrodes because of their combined characteristics of low thermal expansion coefficient, high arc resistance and electrical conductivity of tungsten. Specifically, a W-Cu based alloy containing 5 to 20% by weight of copper is used as a heat sink material because it has suitable thermal conductivity and the thermal expansion coefficient of the W-Cu alloy is similar to that of ceramics. In addition, the W-Cu-based alloy containing 20-40% copper by weight is used to prepare electrical contact materials a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/20B22F1/00B22F3/00B22F9/22C01G41/00C22C1/04C22C27/04
CPCC01P2004/03B22F2998/10C01G41/00C01P2006/40C01P2006/10Y10T428/12181B22F9/22B22F2009/041B22F3/001B22F1/00B22F9/04
Inventor 金柄淇洪性贤禹镛元
Owner KOREA INST OF MACHINERY & MATERIALS
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