Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- OTSUKA CHEM CO LTD
- Publication Date
- 2003-10-15
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a halogen-free flame-retardant epoxy resin composition, a prepreg impregnated with the composition, a laminate, a copper-clad laminate, and a printed circuit board, and a halogen-free composite multilayer board. Permanent epoxy resin composition, coated and semi-cured resin film with copper foil, resin film with foil, composite laminated board and composite multilayer board formed by coating and semi-curing the composition. Background technique
[0002] In recent years, with increasing concern for global environmental issues and human safety, there has been an increasing demand for electrical and electronic devices to be less harmful and safer, in addition to flame retardancy, which was previously required. In other words, electric and electronic devices are required not only to be difficult to burn, but also to generate less harmful gas and smoke.
[0003] Conventionally, brominated epoxy resins containing flame retardant bro...