Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board

A technology of epoxy resin and polyepoxy compound, which is applied in the fields of printed circuit, printed circuit, printed circuit manufacturing, etc., and can solve problems such as adverse effects of epoxy resin curing, moisture resistance, heat resistance decline, etc.
CN1449427AInactive Publication Date: 2003-10-15OTSUKA CHEM CO LTD

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
OTSUKA CHEM CO LTD
Publication Date
2003-10-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

A halogen-free flame-retardant epoxy resin composition which comprises as the essential components (A) at least one crosslinked phenoxyphosphazene compound, (B) at least one polyepoxide compound such as bisphenol A type epoxy resin, (C) a curing agent for epoxy resins, e.g., bisphenol A type novolak resin, and (D) a curing accelerator for epoxy resins, and contains 0 to 50 wt.% of an inorganic filler.
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Description

technical field

[0001] The invention relates to a halogen-free flame-retardant epoxy resin composition, a prepreg impregnated with the composition, a laminate, a copper-clad laminate, and a printed circuit board, and a halogen-free composite multilayer board. Permanent epoxy resin composition, coated and semi-cured resin film with copper foil, resin film with foil, composite laminated board and composite multilayer board formed by coating and semi-curing the composition. Background technique

[0002] In recent years, with increasing concern for global environmental issues and human safety, there has been an increasing demand for electrical and electronic devices to be less harmful and safer, in addition to flame retardancy, which was previously required. In other words, electric and electronic devices are required not only to be difficult to burn, but also to generate less harmful gas and smoke.

[0003] Conventionally, brominated epoxy resins containing flame retardant bro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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