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Dielectric ceramic composition, multi-layer ceramic chip capacitor with the same composition and method for producing the said capacitor

A technology of dielectric ceramics and compositions, applied in the direction of fixed capacitor dielectrics, capacitors, fixed capacitors, etc., can solve the problems of blockage of the inner electrode layer, decrease in capacitance, damage, etc.

Inactive Publication Date: 2004-01-21
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, at a high sintering temperature, blockage or damage often occurs between the internal electrode layers, so that a decrease in capacitance and a short circuit between the internal electrode layers are prone to occur.

Method used

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  • Dielectric ceramic composition, multi-layer ceramic chip capacitor with the same composition and method for producing the said capacitor
  • Dielectric ceramic composition, multi-layer ceramic chip capacitor with the same composition and method for producing the said capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0047] according to figure 1 The preparation method, prepared a multilayer ceramic chip capacitor.

[0048] First, mix the starting raw material BaCO at a molar ratio of 1:1 3 and TiO 2 , and react at 900-1200 °C to obtain BaTiO 3 . BaTiO will be thus obtained 3 Grinding to BaTiO with a particle size of 0.8-1.2μm 3 powder.

[0049] Weigh and mix BaTiO 3 , MgCO 3 , Y 2 o 3 and Cr 2 o 3 powder, and BCG and Mn as sintering aids 2 V 2 o 7 . By heating BaCO at 1000°C or higher 3 , CaCO 3 and SiO 2 The powder was calcined for 2 hours to obtain BCG. By mixing MnO and V at a temperature of 650-680°C 2 o 5 Calcined for 2 hours to obtain Mn 2 V 2 o 7 . The sintering aid thus obtained is used after being ground to a particle size of 1.0 μm or less.

[0050] Weighed powders were wet mixed, ground, dehydrated and dried.

[0051] An organic binder prepared by dissolving the binder in an organic solvent is added to the dried powder and mixed to obtain a slurry. Th...

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Abstract

Multilayer ceramic chip capacitors which satisfy X5R (-55 to 85 DEG C., DeltaC=+-15%) requirements and which are compatible with reducing atmosphere sintering conditions so that base metals such as nickel and nickel alloys may be used for internal electrodes are made in accordance with the invention. The multilayer ceramic chip capacitor comprises alternately staked, dielectric ceramic layers and internal electrode layers wherein dielectric ceramic layers comprise per 100 mol of BaTiO3, BaTiO3; MgCO3: 0.2 to 3.0 mol; at least one selected from Y2O3, Ho2O3, Dy2O3 and Yb2O3: 0.05 to 1.5 mol; Cr2O3: 0.1 to 1.5 mol; BaxCa(1-x)SiO3 (provided that 0<=x<=1): 0.2 to 3.0 mol; and Mn2V2O7: 0.01 to 1.5 mol. The multilayer ceramic chip capacitor of the present invention has a high dielectric constant, satisfies X5R characteristics can be sintered at a low temperature of 1,200 to 1,250 DEG C.

Description

technical field [0001] The invention relates to a non-reducible dielectric ceramic composition, more particularly to a non-reducible ceramic composition which has a high dielectric constant during low-temperature sintering and satisfies the X5R characteristic (-55-85°C, ΔC=±15%) The dielectric ceramic composition of the invention relates to a multilayer ceramic chip capacitor using the composition and a preparation method of the multilayer ceramic chip capacitor. Background technique [0002] Multilayer ceramic chip capacitors are widely used as electronic components featuring small size, large capacitance, and high reliability, and a large number of them are used in one electronic device. In recent years, as devices tend to be miniaturized and high-performance, there is an increasing need to develop multilayer ceramic chip capacitors with smaller size, higher capacitance, lower cost, and higher reliability. Multilayer ceramic chip capacitors are generally manufactured by a...

Claims

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Application Information

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IPC IPC(8): C04B35/46C04B35/468H01B3/12H01G4/12
CPCC04B2235/3239C04B2235/3454C04B2235/3206C04B2235/3215H01G4/1227C04B35/4682C04B2235/3208C04B2235/6025C04B2235/77C04B2235/96C04B2235/3241C04B2235/3436C04B2235/3262C04B2235/3224C04B35/62675C04B2235/3225
Inventor 朴海成许康宪金佑燮金俊熙金钟翰
Owner SAMSUNG ELECTRO MECHANICS CO LTD