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Foam eliminating dispersing agent for developer solution of photosensitive resists

A photoresist and developer technology, applied in foam dispersion/prevention, photosensitive materials for optomechanical equipment, optics, etc., can solve the problem of reduced defoaming effect, easy generation of scum, and scum dispersibility. It is sufficient to achieve high defoaming properties, prevention of adhesion to the resist or its substrate, and excellent dispersibility.

Inactive Publication Date: 2004-06-09
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, these conventional antifoaming agents cannot be said to be sufficiently dispersible to the scum generated in the developer, and although the antifoaming agent has a certain degree of antifoaming effect at the initial stage of its use, as The increase in the amount of resist components dissolved or dispersed in the developer solution sharply reduces the defoaming effect, and there is also the disadvantage that scum is easily generated

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0041] Hereinafter, the present invention will be described more specifically by way of examples and comparative examples. In addition, unless otherwise specified, "part" and "%" in the following Examples and comparative examples represent mass.

[0042] In the test, the defoamers of Examples 1 to 9 and Comparative Examples 1 to 10 shown below were used. Examples 1 to 7 and Comparative Examples 1 and 2 are partial fatty acid esters obtained by esterifying mixed fatty acids with aliphatic trihydric alcohols. Table 1 shows the fatty acid composition (%) and ester composition (%). In addition, the fatty acid composition was measured by gas chromatography (detector: FID) after saponification of the sample according to the standard oil and fat analysis method. In addition, the ester composition was measured by the TLC-FID method (Yatron Corporation, Model Iatroskian MK5).

[0043] Example

[0044] In the table, G means glycerin, TP means trimethylolpropane

Embodiment 1

[0046] A mixture of 100 parts of partial fatty acid ester of Example 1 and 50 parts of polyether polyol ester (dioctadecanoic acid ester of block adduct of 80 moles of propylene oxide and 30 moles of ethylene oxide of propylene glycol).

Embodiment 2

[0048] A mixture of 100 parts of partial fatty acid ester of Example 2 and 50 parts of polyether polyol ester (trilaurate of a random adduct of 50 moles of propylene oxide and 30 moles of ethylene oxide of trimethylolpropane).

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PUM

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Abstract

Provided is a defoaming dispersant for a resist developer solution, the dispersant having excellent defoaming property for foams in a developer solution and excellent dispersibility of scum produced in the developer solution in a developing process of a photoresist using the developer solution. The defoaming dispersant for a photoresist developer solution contains a partial fatty acid ester obtained by allowing a mixture fatty acid having the proportion of 5 to 300 parts by mass of 6-14C middle fatty acid with respect to 100 parts by mass of >=15C higher fatty acid to react with an aliphatic trihydric alcohol.

Description

technical field [0001] The present invention relates to the dispersion of scum that is excellent in the defoaming property against the foaming of the developing solution and scum generated in the developing solution in the developing process of a photosensitive resist (hereinafter simply referred to as "resist") using a developing solution Antifoaming and dispersing agent for resist developing solution with excellent properties. Background technique [0002] Conventionally, resists have been widely used in the formation of wiring patterns such as printed circuit boards, integrated circuits, and color filters. In the process of forming a wiring pattern, a film or liquid resist is usually laminated or coated on a base material, and then the resist is irradiated with active radiation such as ultraviolet rays, X-rays, and electron beams to expose it. After the resist is cured in a pattern, the resist is developed by removing the uncured resist portion (non-irradiated portion) w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004B01D19/04C09K23/00G03F7/00
CPCG03F7/0397G03F7/40G03F7/322G03F7/004G03F7/095
Inventor 保坂将毅川俣大雅
Owner ADEKA CORP
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