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Making process of pattern on wafer and its application

A manufacturing method and wafer technology, which are applied in the field of pattern making on wafers, can solve the problems of difficult process control, low production efficiency, cracks and the like, and achieve the effects of simple equipment, low cost and low investment.

Inactive Publication Date: 2004-09-08
周照耀
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the silicon material is hard and brittle, it is easy to be broken or cracked during the cutting process, resulting in waste products. The process is difficult to control and the production efficiency is low.

Method used

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  • Making process of pattern on wafer and its application
  • Making process of pattern on wafer and its application

Examples

Experimental program
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Effect test

Embodiment 1

[0021] Embodiment 1 adopts light-transmitting good glass to make a disc with a central hole, the size of which is consistent with that of a 120mm disc, and then coats the glass disc with photosensitive adhesive to make a recordable disc; Record the pattern that needs to be etched on the silicon dioxide film on the wafer. The light source in the disc recorder is a laser with a wavelength of 650nm; then develop the patterned glass disc to make a mask plate; the same method produces metal aluminum wiring Reticle. Then put the glass wafer mask plate corresponding to the etching pattern of the silicon dioxide film layer on the silicon wafer coated with photosensitive adhesive through oxidation, and use the light source to irradiate and expose the area determined by the mask plate, and then place the silicon wafer on the Develop in the developer; then etch the silicon wafer, and then remove the hardened photoresist on the silicon wafer; vapor-deposit a layer of metal aluminum on the...

Embodiment 2

[0023] first use figure 1 The mold shown is used to shape the desired silicon wafer. Such as figure 1 As shown, the male mold 1 and the male mold 2 are placed in the female mold 3, and the heating element 4 is energized to preheat the mold, and the thermocouple 5 can collect the temperature on the female mold 3. After reaching the set temperature, the male mold 1 is removed from the The female mold 3 exits upwards, and the male mold 2 stays at the bottom of the female mold 3. Liquid silicon is poured into the female mold 3. The superheated temperature of the liquid silicon is 1500°C, and it will not solidify immediately when poured into the female mold 3. The positive mold 1 is then pressed against the liquid silicon. According to the temperature collected by the temperature acquisition sensor, it is judged whether to pass water through the cooling pipe 6 to cool the female mold 3 or to energize the heating element 4 to heat the female mold 3, so as to ensure that the liquid...

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Abstract

The making process of pattern n wafer includes the following steps: making wafer with central hole; painting the wafer with photoresist to make CD-recordable; writnig pattern on the CD in CD writing unit; and developing the written CD. The present invention makes it possible to making required pattern in wafer with central hole, and may be used in forming complicated and small-sized IC pattern in high precision and stable quality.

Description

technical field [0001] The invention relates to the technical field of micromachining, in particular to a method for making a pattern on a wafer and its application. Background technique [0002] At present, the optical disc that can be used for recording is made by coating a layer of photosensitive adhesive on the plastic disc. Put the optical disc that can be used for recording in the optical disc recorder. Under the irradiation of a strong laser beam, the photosensitive adhesive of the recording medium will change. The formation of light spots, the presence or absence of light spots represents 0 and 1, so as to realize the storage of information. Forming a channel composed of light spots on the photosensitive adhesive is actually a microscopic spot pattern, and the recorded optical disc is only used for information storage. In the prior art, the general integrated circuit manufacturing method is mainly an optical projection manufacturing method,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/00G11B7/26
Inventor 周照耀
Owner 周照耀
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