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Epoxy resin compsn. and its application

A technology of epoxy resin and composition, applied in the direction of synthetic resin layered products, layered products, wood layered products, etc., can solve the problem that it cannot be made into varnish

Inactive Publication Date: 2004-10-27
PRINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the epoxy resin obtained from the conventional p-hydroxybenzaldehyde and phenol triphenylmethane type phenol resin is used as a raw material to make solutions such as xylene, acetone, methyl ethyl ketone, methyl cellosolve, etc., due to its will fall out of solution and therefore cannot be made into the varnish required for making prepregs

Method used

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  • Epoxy resin compsn. and its application
  • Epoxy resin compsn. and its application
  • Epoxy resin compsn. and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] Synthesis Example of Epoxy Resin (EX-1)

[0074]Put 294 parts of triphenylmethane type phenolic resin (TPM-1) and 1388 parts of epichlorohydrin obtained in the synthesis example into a flask equipped with a thermometer, a cooling tube and a stirrer, and dissolve them under stirring. After heating up to 70 degreeC, 20 parts of tetramethylammonium chloride 20% aqueous solutions were added, and it stirred for further 3 hours. Then, 238 parts of 48% sodium hydroxide aqueous solutions were added separately over 90 minutes, and it was made to react further for 1 hour. After the reaction, excess epichlorohydrin, water and the like were distilled off under heating and pressure at 120°C. After adding 460 parts of xylene and 500 parts of water to the residue and washing with water, water was separated. Furthermore, the temperature of this xylene solution was raised to 70 degreeC, 25 parts of 48% sodium hydroxide aqueous solutions were added, and it was made to react for 2 hours...

Embodiment 2

[0076] Synthesis Example of Epoxy Resin (EX-3)

[0077] Synthesis was carried out in the same manner as epoxy resin synthesis example-1, except that the phenol resin obtained in triphenylmethane type phenol resin synthesis example (TPM-3) was used. The solid content of gained methyl ethyl ketone solution is 80.2% (weight), and epoxy group equivalent is 169g / eq (solid conversion value), and the content of m=0 is 62.0% (weight) (m=0.68), chromaticity is Gard The sodium color value is counted as 3. In addition, after storing the methyl ethyl ketone solution at 25° C. for 1 day, a heating cycle of storing at 7° C. for 1 day was performed as one cycle. As a result, no epoxy resin was precipitated even after 30 cycles.

Embodiment 4

[0085] Synthesis Example of Epoxy Resin (EX-5)

[0086] In the flask that thermometer, cooling pipe, stirrer are equipped with, pack into 294 parts by the content rate of the phenolic resin of n=0 82.7% (weight), phenol content rate 0.8% (weight), hydroxyl equivalent is 98g / eq Triphenylmethane type phenolic resin (TPM-A) obtained from p-hydroxybenzaldehyde and phenol (n = 0.2, 4, 4', 4"-trihydroxyl (triphenylmethane) content = 58% by weight , 4,4', 2"-trihydroxyl (triphenylmethane) content: 33% (weight), 4,2', 2"-trihydroxyl (triphenylmethane) content: 9% (weight) ), 1388 parts of epichlorohydrin are dissolved under stirring. After being warmed up to 70°C, add 20 parts of tetramethylammonium chloride 20% aqueous solution, and further stir for 3 hours. After that, add 48% hydrogen separately through 90 minutes 238 parts of sodium oxide aqueous solution, and further reacted for 1 hour. After the reaction was completed, under heating and pressure at 120°C, excess epichlorohydrin...

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Abstract

An epoxy resin composition, a prepreg prepared by using the composition and a layered plate comprising the prepreg are provided, to prevent the precipitation of an epoxy resin from a solution during storage, to improve the stability of the varnish used in the preparation of a prepreg and to enhance of the heat resistance of a layered plate. The epoxy resin composition comprises an epoxy resin A represented by the formula 2 which is obtained by reacting a triphenylmethane-type phenol resin containing 30-70 wt% of 4,4'4'-trihydroxy(triphenylmethane) represented by the formula 1 and epichlorohydrin or [beta]-methyl epihalohydrin. In the formula 1, R1 to R5 are independently H or a C1-C6 alkyl group; an n is an integer of 0-0.4 on the average, and in the formula 2, R'1 to R'5 are independently H or a C1-C6 alkyl group; an m is an integer of 0-0.7 on the average. Preferably the triphenylmethane-type phenol resin comprises 40-60 wt% of 4,4'4'-trihydroxy(triphenylmethane), 25-50 wt% of 4,4'2'-trihydroxy(triphenylmethane), and 3-20 wt% of 4,2'2'-trihydroxy(triphenylmethane), and is prepared from p-hydroxybenzaldehyde and phenol in the presence of an acid catalyst.

Description

technical field [0001] The present invention relates to an epoxy resin composition which imparts high heat resistance to a laminate and has excellent solubility in solvents, a prepreg obtained therefrom, and a laminate thereof. Background technique [0002] By curing various curing agents, the epoxy resin becomes a cured product with excellent mechanical properties, chemical resistance, heat resistance, water resistance, electrical properties, etc., so that it can be used in coatings, adhesives, laminates, Widely used in casting materials, molding materials, etc. Especially in the application of laminated boards, heat resistance and chemical resistance etc. are required, and o-cresol novolac epoxy resin has been most commonly used until now. In recent years, along with higher-density wiring and thinner sheets, the demand for resins with higher heat resistance has also increased. As an epoxy resin that can meet such demands, JP-A-57-13571 describes that an epoxy resin obtai...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00B27K3/34B32B21/13C08L63/04
CPCC08L63/00C08L61/06C08J5/24B32B27/38C08L2205/03C08L2205/02C08L2201/00C08J2363/00C08J2361/06
Inventor 安田清美田原修二
Owner PRINTEC CORP
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