Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil

Abstract

The object is to provide carrier foil-incorporated copper foil which permits drilling by a carbon dioxide laser when on the surface of outer-layer copper foil of a copper-clad laminate there is no nickel assist metal layer or an organic material film to increase the absorption of laser light. For this purpose, there is used, for example, carrier foil-incorporated copper foil in which copper foil for printed wiring board manufacturing having a nodular-treated surface on the side of one surface of a bulk copper layer and carrier foil are laminated via an adhesive interface layer on a side opposite to the nodular-treated surface of the bulk copper layer, the bulk copper layer being formed from a high-carbon copper with a carbon content of 0.03 wt % to 0.40 wt %.

Description

technical field [0001] The present invention relates to copper foil with carrier foil. In particular, it relates to a copper foil useful for perforation processing such as through-hole processing with a carbon dioxide laser. Background technique [0002] In recent years, in response to the demand for thinner, thinner and smaller electronics and electrical appliances, the printed circuit boards mounted therein are being miniaturized, and the wiring circuit density, mounting density, and high multilayer of printed circuit boards have made remarkable progress. The multilayering of printed wiring boards refers to the state in which the layers forming the conductive circuit are multilayered through the insulating resin layer. As the conduction means between the layers forming the conductive circuit, so-called through holes and via holes are generally provided. and other means of interlayer conduction. [0003] The through hole in the interlayer conduction means refers to formin...

AI Technical Summary

Problems solved by technology

In the case of a nickel auxiliary metal layer, it is required to etch and remove the nickel auxiliary metal layer after the laser drilling process, so the nickel component will dissolve in the etching waste liquid or washing water, complicating the waste liquid treatment, and causing the manufacturing operation of the printed circuit board cost increase

On the other hand, in the case of setting an organic material film, since the organic material film is also required to be removed after the laser perforation process, the etching waste liquid or washing water will contain organic material film components, which will also complicate the waste liquid treatment, resulting in Increased manufacturing and running costs of printed circuit boards

[0009] In addition, when removing the nickel auxiliary metal layer by etching, in the state where nickel or nickel alloy and copper coexist, except for the case where only nickel is preferentially dissolved and the copper component is not dissolved, an etchant selective to nickel is used, Usually, the etchant used to remove nickel dissolves nickel slowly, and it will also corrode the copper components that make up the circuit together, forming pores in the circuit, and forming a state in which the circuit dissolves and disappears.

Assuming that the above-mentioned etchant that is selective to nickel is used, since it is a special etchant, it will lead to an increase in production costs

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