Copper foil for printed-wiring board
A copper foil, direct technology, applied in the field of surface treatment, can solve the problems of rough copper foil bright surface, time-wasting, unfavorable, etc., and achieve the effect of improving laser operability
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Embodiment 1
[0044] At pH 4.8, temperature 30°C and current density 1.5A / dm 2 Next, the bright side of an electrolytic copper foil with a thickness of 18 μm in which the matte side of the untreated copper foil was previously roughened was subjected to cathodic plating for twelve seconds in a bath (A) containing:
[0045] 30 g / L FeSO 4 ·7H 2 O, 10 g / L SnSO 4 and 40 g / L of trisodium citrate dihydrate, rinse the copper foil thus plated with water, and at a pH of 4.0, a temperature of 25°C and a current density of 0.5A / dm 2 Next, the shiny side of the copper foil was further cathodically plated for two seconds in another bath (B) containing:
[0046] 5 g / L Na 2 Cr 2 o 7 2H 2 O, the resulting copper foil was rinsed with water and then dried.
[0047] Laminate the matte side of the copper foil to be resin-bonded with an FR-4 grade glass epoxy impregnated base material, and compact the laminate under conditions of a pressure of 4MPa and a temperature of 170°C6 ten minutes to form a coppe...
Embodiment 2
[0050] At pH 4.8, temperature 30°C, current density 1.5A / dm 2 Next, the bright side of an electrolytic copper foil having a thickness of 18 μm in which the matte side of the untreated copper foil was previously roughened was subjected to cathodic plating for twelve seconds in a bath (C) instead of the bath (A) of Example 1 , bath (C) contains:
[0051] 30 g / L FeSO 4 ·7H 2 O, 10 g / L SnSO 4 , 5 g / L Na 2 pH 2 o 2 ·H 2 O and 40 g / L of trisodium citrate dihydrate. After rinsing the obtained electrolytic copper foil with water, in the bath (B) of Example 1, the bright side of the copper foil was heated at a current density of 0.5A / dm 2 The cathodic plating was carried out for two seconds, and the resulting copper foil was rinsed and dried.
[0052] Laminate the matte side of the copper foil to be resin bonded with a FR-4 grade glass epoxy impregnated base material. Laser operability and the amount of attached elements were examined in the same manner as in Example 1, and t...
Embodiment 3
[0054] At pH 4.8, temperature 30°C, current density 1.5A / dm 2 Next, the bright side of an electrolytic copper foil having a thickness of 18 μm in which the matte side of the untreated copper foil was previously roughened was subjected to cathodic plating for twelve seconds in a bath (D) instead of the bath (A) of Example 1, Bath (D) contains:
[0055] 60 g / L FeSO 4 ·7H 2 O, 10 g / L SnSO 4 , 5 g / L NaPH 2 o 2 ·H 2 O and 70 g / L of trisodium citrate dihydrate. After rinsing the obtained electrolytic copper foil with water, at a current density of 0.5A / dm 2 Next, the bright side of the copper foil was cathodically plated in the bath (B) of Example 1 for two seconds, and the resulting copper foil was rinsed and dried.
[0056] Laminate the matte side of the copper foil to be resin bonded with a FR-4 grade glass epoxy impregnated base material. Laser operability and the amount of attached elements were examined in the same manner as in Example 1, and the results obtained are ...
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