Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Restructurable virtual device for software bus and chip structure

A software bus and virtual instrument technology, applied in software simulation/interpretation/simulation, program control devices, etc., can solve the problems of cumbersome instrument use, fixed functions, and unreasonable function arrangements, so as to reduce difficulty, realize reconfiguration, and implement The effect of online adjustments and refactorings

Inactive Publication Date: 2005-01-19
深圳市德普施科技有限公司
View PDF0 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the virtual instruments designed by these development platforms have a common shortcoming, that is, the function of the virtual instrument after the design is completed cannot be changed during the use stage.
For virtual instrument designers and producers, the development often considers the needs of a group, thinks about problems and designs virtual instrument functions from a general and unified perspective, but for a specific user or a specific industrial test task or experiment For example, this kind of functional arrangement may appear extremely unreasonable, and the instrument is more cumbersome to use.
[0004] The function of the virtual instrument designed by the current virtual instrument development platform is fixed, and the user cannot adjust and customize it after leaving the development platform, which causes a lot of inconvenience to the user

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Restructurable virtual device for software bus and chip structure
  • Restructurable virtual device for software bus and chip structure
  • Restructurable virtual device for software bus and chip structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation examples.

[0036] Figure 1 is a model diagram of the software bus of a reconfigurable virtual instrument system, which consists of a software bus, a bus controller and a bus adapter. Each virtual instrument software chip is connected to the software bus through a bus adapter. The software bus is composed of several global memory blocks for exchanging and analyzing data; the bus controller is a program body that runs continuously, and it is responsible for monitoring whether the data of each memory block changes, and when the data changes, it passes through the chip selection signal line in the bus Drive related software chip work; the bus adapter is a COM component plug interface that enhances the connection function. It uses the initialization data of the software chip to perform data welding on the software chip and the software bu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

It is a kind of reconstructable virtual instrument of software bus and chip structure. It relates to the technique in computer field. By adopting the feature that COM component supports direct reference of binary code, it designs the board drive module, software console, software signal processing circuit of virtual instrument as COM component, and the main program as COM container. It assigns several overall memory blocks in main program to simulate the data wire of hardware bus. It designs message-transmitting module to simulate control wire of hardware bus by using the operation system message sending mechanism. It uses COM structure to realize software module dynamic joint; uses software bus to realize data interaction and operation control between software modules. This invention boasts the open structure. It is compatible with virtual instrument software chip with different languages and different platforms. The software chip is plug-and-play and hot plug element.

Description

technical field [0001] The present invention relates to the field of computer application technology, in particular to a user-oriented computer virtual machine designed with the open structure of the software bus and the plug-and-play feature of the COM component, which has the characteristics of computer hardware modular assembly and can be programmed online, debugged and reconfigured. instrument. Background technique [0002] The so-called virtual instrument is to use an ordinary computer, plus specially designed instrument hardware (board) and special software to form a computer with instrument functions. Virtual instrument uses the powerful graphics function of PC to build a virtual instrument panel to complete the control of the instrument, data analysis and display. The function of virtual instrument is defined by software. A computer and a set of boards can form a variety of instruments, and a computer is a small laboratory. Replacing traditional instruments with co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F9/455
Inventor 何岭松
Owner 深圳市德普施科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products