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Etching solution of copper or copper alloy and method for producing electronic substrate using the solution

A technology for etching solutions and electronic substrates, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, and can solve problems such as poor installation and small grounding area

Inactive Publication Date: 2005-01-26
MEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the copper wiring 2c' becomes thinner, the grounding area also becomes smaller, and it is easy to cause poor actual mounting when actually mounting electronic components.

Method used

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  • Etching solution of copper or copper alloy and method for producing electronic substrate using the solution
  • Etching solution of copper or copper alloy and method for producing electronic substrate using the solution
  • Etching solution of copper or copper alloy and method for producing electronic substrate using the solution

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Embodiment Construction

[0020] The etching solution of the present invention will be described.

[0021] (a) Oxidizing agent for copper

[0022] As an oxidizing agent of copper, copper ion and iron ion are mentioned, for example. In the case of copper ions, copper (II) chloride, copper (II) bromide, copper (II) hydroxide, etc. are added to generate copper ions in the solution. In the case of iron ions, with iron (III) chloride, iron (III) bromide, iron (III) iodide, iron (III) sulfate, iron (III) nitrate, iron (III) acetate, etc. produced iron ions. From the viewpoint of removing the copper remaining at the bottom of the copper wiring, the concentration of the oxidizing agent is preferably 1 g / liter; from the viewpoint of not generating copper remaining at the bottom of the copper wiring, it is preferably 50 g / liter or less, particularly preferably 45 g / L or less. In the case of copper ions, it is more preferably 3 to 40 g / liter, and in the case of iron ions, it is more preferably 5 to 30 g / liter...

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Abstract

The present invention provides an etching liquid for copper or a copper alloy capable of producing an electronic substrate in which side etches are reduced, the narrowing of the upper part of copper wiring is suppressed, and short circuits are not generated, and to provide a method for producing an electronic substrate using the same. In the method for producing an electronic substrate, a copper layer (2a) formed on an electrically insulated base material (1) is etched so as to be a prescribed shape to form copper wiring (2c). After the main etching, copper (A) to be removed remaining in the cuff part of copper wiring (2b) is removed with an aqueous solution comprising (a) an oxidizer for copper by 1 to 50 g / L, (b) at least one kind of acid selected from the group consisting of hydrochloric acid by 1 to 400g / L and organic acid by 1 to 200 g / L, and (c) at least one kind of polymer selected from the group consisting of polyalkylene glycol and a copolymer of polyamine and polyalkylene glycol by 0.01 to 50 g / L.

Description

technical field [0001] The present invention relates to a copper or copper alloy etching solution capable of producing an electronic substrate with less side etching, suppressing thinning of the upper portion of copper wiring, and no short circuit, and a method for producing an electronic substrate using the solution. Background technique [0002] There are various methods for forming the copper wiring of the electronic substrate, and the following methods are mostly used. As shown in Fig. 2 (a) to (c), the glass fiber substrate impregnated with epoxy resin, the aromatic poly A method of forming copper wiring by etching the copper layer 2a after forming an etching resist layer of a desired shape on the surface of the copper layer 2a formed on the surface of an electrically insulating substrate 1 such as an amide fiber substrate or a ceramic substrate (erasing method). [0003] However, in the above method, as shown in A of FIG. 2( b ), copper tends to remain on the surface o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18H05K3/06
Inventor 户田健次
Owner MEC CO LTD
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