Preparation method for grinding wheel of photosensitive resin binding agent

A technology of photosensitive resin and bonding agent, which is applied in the direction of grinding/polishing equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of short production time, long time, low energy consumption, etc., to reduce manufacturing time and reduce manufacturing energy Consumption, the effect of reducing manufacturing costs

Inactive Publication Date: 2005-06-08
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention seeks to solve the disadvantages of high energy consumption and long time in the production of existing grinding wheels, and provides a grinding wheel preparation method with low energy consumption and short production time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] 1. Make grinding wheel base and mold: metal base size: diameter 90mm, thickness: 5mm; overall size of grinding wheel: diameter 100mm, thickness 5mm;

[0015] 2. Mixing materials: formula, mix 15g of commercially available photosensitive resin binder, 5.74g of artificial diamond with abrasive particle size specification of 6-12μm, and 0.75g of silicon dioxide micropowder with size specification of 2μm, and stir the above materials evenly with a mixer ;

[0016] 3. Curing and molding: fill the uniformly stirred filler in the curing cavity of the mold in stages, and then layer by layer light curing: that is, after each filler is 0.5mm, use the EX250 ultraviolet irradiation device produced by Japan HOYO-SCHOTT company, the wavelength The distribution range is 200nm to 500nm, the light intensity is 2.4w / cm, and the curing time is 15s until it is formed.

[0017] Grinding wheel use: precision grinding of ceramics and silicon wafers.

Embodiment 2

[0019] 1. Make grinding wheel base and mold: metal base size: diameter 90mm, thickness: 5mm; overall size of grinding wheel: diameter 100mm, thickness 5mm;

[0020] 2. Mixing materials: formula, 15g of commercially available photosensitive resin binder, 5.74g of artificial diamond with abrasive particle size specification of 6-12μm, 0.75g size specification: L: 20-30um, diameter of 0.5-1um calcium carbide fiber micropowder Mix, use a mixer to stir the above materials evenly;

[0021] 3. Curing and molding: fill the uniformly stirred filler in the curing cavity of the mold in stages, and then layer by layer light curing: that is, after each filler is 0.5mm, use the EX250 ultraviolet irradiation device produced by Japan HOYO-SCHOTT company, the wavelength The distribution range is 200nm to 500nm, the light intensity is 2.4w / cm, and the curing time is 15s until it is formed.

[0022] Grinding wheel use: precision grinding of ceramics and silicon wafers.

Embodiment 3

[0024] 1. Make grinding wheel base and mold: metal base size: diameter 90mm, thickness: 5mm; overall size of grinding wheel: diameter 100mm, thickness 5mm;

[0025] 2. Mixing: formula, mix 15g of commercially available photosensitive resin binder, 5.74g of silicon carbide with an abrasive particle size of 16-20μm, and 0.75g of silicon dioxide micropowder with a size of 2um, and stir the above materials evenly with a mixer;

[0026] 3. Curing and molding: fill the uniformly stirred filler in the curing cavity of the mold in stages, and then layer by layer light curing: that is, after each filler is 0.5mm, use the EX250 ultraviolet irradiation device produced by Japan HOYO-SCHOTT company, the wavelength The distribution range is 200nm to 500nm, the light intensity is 2.4w / cm, and the curing time is 15s until it is formed.

[0027] Grinding wheel use: precision grinding of ceramics and silicon wafers.

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Abstract

A process for preparing abrasive disk by use of photosensitive resin adhesive includes such steps as making its main body and mould, mixing the photosensitive resin adhesive with abrasive particles to obtain filler, and filling the filler in the solidifying cavity of said main body step by step while using light to irradiate it step by step for solidifying.

Description

1. Technical field [0001] The invention relates to a preparation method of a grinding wheel, and is especially suitable for the preparation method of a photosensitive resin bonded grinding wheel. 2. Background technology [0002] Abrasives are the main tools used in large quantities in the machinery manufacturing industry and are also the main consumables. The grinding wheel is the main representative of abrasives. At present, the binder of resin bonded grinding wheel used at home and abroad mainly adopts thermosetting resin represented by aldehyde phenol resin, and the abrasive grains are combined by heating and sintering. This manufacturing process is as follows: mixing materials, mixing them with a mixer The abrasive grains are evenly mixed with the resin bond; molding, put the uniformly mixed abrasive grains and resin into the molding mold, and press to form by a press; solidify, the pressed cutting grinding wheel is heated and kept in an electric heating furnace, and pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00
Inventor 姚春燕彭伟
Owner ZHEJIANG UNIV OF TECH
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