Super low temperature sintered ceramic medium materials, manufacturing method thereof and capacitor made therefrom
A technology of ceramic capacitors and ceramic dielectrics, applied in the direction of laminated capacitors, fixed capacitor dielectrics, fixed capacitor parts, etc., can solve problems such as environmental pollution, unfavorable development and needs, and achieve reduced production costs, excellent thermal stability, Effect of low temperature coefficient of dielectric constant
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Embodiment 1
[0032] Raw materials with a purity of 99.5 or more were mixed with 1 mole of BaCO 3 , 1.0025 moles of Nd 2 o 3 , 5.0 moles of TiO 2 Ratio, ball milling and mixing evenly, pre-calcine the mixture at 1100°C for 2.5 hours to obtain BaNd 2+X Ti 5 o 14+1.5X (X=0.005) Main briquette material.
[0033] Mix raw materials with a purity of 99.5 or more in a predetermined ratio with H 3 BO 3 、Al 2 o 3 , SiO 2 , CaCO 3 Raw materials, ball-milled uniformly, and then melted at 1150°C, thus obtaining uniform auxiliary component B 2 o 3 、Al 2 o 3 , SiO 2 , CaO glass powder.
[0034] Then, add auxiliary components to the main component according to a predetermined ratio, as shown in Table 1, make ceramic materials according to the material production process, and then add organic binders and ethanol and other solvents according to the production process of chip MLCC to form a slurry , cast the slurry into a membrane with a thickness of 20 microns, print full silver (Ag) or sil...
Embodiment 2
[0040] Raw materials with a purity of 99.5 or more were mixed with 1 mole of BaCO 3 , 1.01 mol Nd 2 o 3 , 5.0 moles of TiO 2 Ratio, ball milling and mixing evenly, pre-calcine the mixture at 1150°C for 2.5 hours to obtain BaNd 2+X Ti 5 o 14+1.5X (X=0.02) Main component material.
[0041] Mix raw materials with a purity of 99.5 or more in a predetermined ratio with H 3 BO 3 、Al 2 o 3 , SiO 2 , CaCO 3 Raw materials, ball-milled uniformly, and then melted at 1200°C, thus obtaining uniform auxiliary component B 2 o 3 、Al 2 o 3 , SiO 2 , CaO glass powder.
[0042] Then add auxiliary components in the main component according to a predetermined ratio, as shown in Table 3, and manufacture and test the multilayer chip ceramic capacitor according to the method of Example 1. The test results are shown in Table 4.
[0043]
[0044] invention material
[0045] It can be seen from Table 4 that the multilayer chip ceramic capacitor according to the prese...
Embodiment 3
[0047] Raw materials with a purity of 99.5 or more were mixed with 1 mole of BaCO 3 , 1.05 mol Nd 2 o 3 , 5.0 mol TiO 2 Ratio, ball milling and mixing evenly, pre-calcine the mixture at 1150°C for 2.5 hours to obtain BaNd 2+X Ti 5 o 14+1.5X (X=0.1) Main component material.
[0048] Mix raw materials with a purity of 99.5 or more in a predetermined ratio with H 3 BO 3 、Al 2 o 3 , SiO 2 , CaCO 3 Raw materials, ball-milled uniformly, and then melted at 1250°C, thus obtaining uniform auxiliary component B 2 o 3 、Al 2 o 3 , SiO 2 , CaO glass powder.
[0049] Then add auxiliary components in the main component according to a predetermined ratio, as shown in Table 5, and manufacture and test the multilayer chip ceramic capacitor according to the method of Example 1. The test results are shown in Table 6.
[0050]
[0051] material name
[0052] It can be seen from Table 6 that the multilayer chip ceramic capacitor according to the present inventio...
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