Electronic heat pump device, electronic equipment using electronic heat pump device and method of manufacturing electronic heat pump device

Abstract

An electronic heat pump device has an emitter and a collector, stems supporting these components, a spacing retention member for keeping a spacing between the stems constant, and a sealing member for maintaining a vacuum between the stems. The emitter has a first semiconductor substrate and an emitter electrode, while the collector has a second semiconductor substrate and a collector electrode. The emitter electrode and the collector electrode are disposed so as to be opposed to each other with a space interposed therebetween. At least one of the first and second semiconductor substrates is integrally formed with electrically and thermally insulative spacers that keep the space between the emitter electrode and the collector electrode constant.

Description

field of invention [0001] The present invention relates to an electronic heat pump device, for example, which converts electrical energy into heat energy (electrothermal conversion). Electron emission by tunnel effect, no coolant and compressor required, no mechanical moving parts, one side of the device is cooled while the other is heated. Furthermore, it relates to an electronic device using the electronic heat pump device, and a method of manufacturing the electronic heat pump device. Background technique [0002] As a conventional electronic heat pump device, there is generally a Peltier element. So-called Peltier elements, such as image 3 Shown in 7 is an electronic heat pump device utilizing the Peltier effect with a p-type semiconductor 51, an n-type semiconductor 52 and a metal electrode 53, and a voltage is applied to provide a current, between each of the above-mentioned semiconductors 51, 52 and the above-mentioned electrodes 53 Heat absorption or heat generat...

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Problems solved by technology

[0019] In this case, it is necessary to constantly operate the gap adjustment circuit of the above-mentioned piezoelectric element 86, which can be considered as an increase in the power consumption of the irrelevant circuit as the original electronic heat pump.

In addition, since the electronic heat pump devices are controlled by the above-mentioned circuits, it is difficult to unitize a plurality of electronic heat pump devices in consideration of the expansion of the heat pump capacity.

And, when the heat generated by the collector electrode 82 reaches the second heat conduction part 85, there is a wiring connecting the piezoelectric element 86 and the capacitance controller 88, so heat generated from the collector electrode 82 to the second heat conduction part 85 is generated. The heat transfer of the heat conduction part 85 is greatly lost

[0020] and, in Figure 42 In the fourth electronic heat pump device shown, it is difficult to arrange the medium 94 at a fixed area ratio with respect to the emitter 91 and the collector 92.

In addition, the above-mentioned medium 94 is scattered and arranged on the electrode by sputtering, etc., and electrons are filtered, and heat is transferred along with the electrons. Like the above-mentioned Peltier element, there is a problem that the heat of the above-mentioned medium 94 flows back, the cooling efficiency deteriorates, and the power consumption increases. question

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