Catalyst and method for decomposition of perfluoro-compound in waste gas

A technology of perfluorinated compounds and catalysts, which is applied in the fields of perfluorocarbon/hydrofluorocarbon capture, chemical instruments and methods, physical/chemical process catalysts, etc., which can solve the problem that catalyst life cannot be guaranteed by complex preparation methods of catalysts, etc. problem, to achieve high catalytic activity and durability
CN1681587AInactive Publication Date: 2005-10-12KOREA RES INST OF CHEM TECH +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KOREA RES INST OF CHEM TECH
Publication Date
2005-10-12
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention relates to a catalyst for the decomposition of exhausted perfluoro-compounds (PFCs) and a catalytic decomposition method of PFCs by using the same. More particularly, the present invention relates to a PFC decomposition catalyst prepared in such a manner that a surface of aluminum oxide is loaded with phosphorous (P) component at a aluminum / phosphorous mole ratio of 10 to 100 and a decomposition method of PFCs by using the catalyst. The present catalyst can be decomposed PFCs at 100% rate exhausted from semiconductor manufacturing industry and thus prevent the release of PFCs having high global warming potential into atmosphere.
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Description

technical field

[0001] The present invention relates to a catalyst for decomposing perfluorinated compounds (PFCs) in exhaust gas and a method for decomposing perfluorinated compounds using the catalyst. More specifically, the present invention relates to a catalyst for decomposing PFCs, which is prepared by loading phosphorus (P) components on the surface of alumina with a molar ratio of aluminum / phosphorus in the range of 10-100, and also relates to a A method for decomposing PFCs using the catalyst. The catalyst of the invention can 100% decompose the waste PFCs in the semiconductor and LCD manufacturing processes, thereby preventing the PFCs that cause global warming from being released into the atmosphere. Background technique

[0002] PFCs are widely used as etchant in semiconductor or LCD etching process and as cleaning gas in chemical vapor deposition process. PFCs with the above uses include CF 4 、CHF 3 、CH 2 f 2 、C 2 f 4 、C 2 f 6 、C 3 f 6 、C 3 f 8 、C ...

Claims

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