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Micro-channel heat sink structure for semiconductor laser head pumping source and preparing method thereof

A micro-semiconductor technology for pump sources, applied in the field of micro-channel heat sink structure and its preparation for the pump source of new semiconductor laser head, can solve the problem of difficult manufacturing process, high thermal resistance of large-channel heat sinks, and high cost of semiconductor lasers Problems such as the head pump source, etc., to avoid modification and reduce costs

Inactive Publication Date: 2005-10-26
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the technical problems of high thermal resistance of large-channel heat sinks in the background technology, difficult manufacturing process of conventional micro-channel heat sinks, high cost and inability to be directly applied to the pumping sources of semiconductor laser heads widely used at present, the purpose of the present invention is to The microchannel technology is directly introduced into the heat sink of the pump source of the semiconductor laser head, and the overall performance of the heat sink is improved while reducing the difficulty of the process and the production cost. In order to achieve the above purpose, the present invention provides a microchannel for the pump source of the semiconductor laser head Heat sink structure and preparation method

Method used

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  • Micro-channel heat sink structure for semiconductor laser head pumping source and preparing method thereof
  • Micro-channel heat sink structure for semiconductor laser head pumping source and preparing method thereof
  • Micro-channel heat sink structure for semiconductor laser head pumping source and preparing method thereof

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Embodiment 1

[0017] Embodiment 1: The heat sink base 1 and the cylinder 6 can be made of materials such as oxygen-free copper, CuW alloy or aluminum. The water pipe joint 7 adopts two water pipe joints.

[0018] A. Select the size X×Y×Z of the heat sink rectangular base as 58×8×12mm 3 , the material can be made of oxygen-free copper material. Two first blind holes 2 and two blind holes 3 with a diameter R1 of 4 mm and a depth H of 2 mm are processed on both ends of the heat sink base 1. The axes of the first blind hole 2 and the second blind hole 3 are on the heat sink base. 1 in 8×12mm 2 The coordinates on the rectangular section of are (4mm, 6mm), such as figure 1 , figure 2 .

[0019] B. Process a through hole 4 with a diameter R2 of 1 mm in step A, and the axis of the through hole 4 is 8×12 mm in the heat sink matrix 1 2 The coordinates on the rectangular section are (4mm, 4.5mm), such as image 3 , Figure 4 .

[0020] C. Utilize a precision wire cutting machine to enter thr...

Embodiment 2

[0024] A. According to actual needs, select the size X×Y×Z of the heat sink rectangular base to be 60×10×14mm 3 , the material can be made of CuW alloy or aluminum. Two first blind holes 2 with a diameter R1 of 5 mm and a depth H of 2.5 mm are machined on both ends of the heat sink base, the second blind hole 3, the first blind hole 2, and the axis of the second blind hole 3 are in the heat sink 10×14mm in base body 1 2 The coordinates on the rectangular section are (5mm, 7mm), such as figure 1 , figure 2 .

[0025] B. Process a through hole 4 with a diameter R2 of 0.8mm in step A according to actual needs, and the axis of the through hole 4 is 10×14mm in the heat sink base 1 2 The coordinates on the rectangular section are (5mm, 4.9mm), such as image 3 , Figure 4 .

[0026] C. Utilize the precision wire cutting machine to enter by the through hole 4 of step B, cut out 20 mutually parallel microchannels between the first blind hole 2 and the second blind hole 3 accor...

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Abstract

This invention relates to a micro-channel heat sink structure used in a semiconductor laser head pump source and its preparation method, which processes a blind hole at the either end of the a square heat sink matrix with the diameter R1 and depth H and processes a through hole with the diameter of R2 at the bottom of the blind hole and R2 is greater than R1, cuts the micro-channel zone, the channel is in the same direction with the through hole, its wall face of the channel is vertical to the upper and lower surface of the heat sink matrix, the channel zone cross section is in the blind hole, selects a cylinder in the same material with the heat sink matrix to be inserted into the through hole, the blind hole is connected with the water pipe connector to finish the processing. The structure includes: a heat sink matrix, a first blind hole, a second blind hole, a through hole, a micro-channel zone, a cylinder, and a water pipe connector.

Description

technical field [0001] The invention belongs to the technical field of semiconductor optoelectronics, and relates to a novel semiconductor laser head pumping source microchannel heat sink structure and a preparation method thereof. Background technique [0002] At present, the heat sink for the pump source of the semiconductor laser head usually adopts a large channel structure, and the high thermal resistance of this structure can no longer meet the increasing heat dissipation needs; while the conventional micro-channel heat sink generally adopts five layers of high thermal conductivity rectangles with different internal structures. A structure in which sheet materials are combined. This structure requires precise processing of five layers of highly thermally conductive rectangular sheet materials, and then uses diffusion welding technology to accurately and tightly bond them together. The structure of the pump source is inconsistent, and it is difficult to use it directly....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024
CPCH01L2924/0002
Inventor 尧舜王立军刘云张彪姚迪王超
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI