Radiation-curable resin composition and cured product thereof
A radiation curing resin and radiation curing technology, applied in the field of curable composition and its preparation, can solve problems such as impracticality
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[0182] According to the above-mentioned preferred preparation method, compared with the method of adding a filler (eg, silica particles) and a surface treatment agent such as a silane coupling agent to the resin composition, and then dispersing the filler, there is an advantage that a large amount of particle size can be dispersed Smaller particles without agglomeration. Therefore, the resulting radiation curable resin composition is a composition in which a sufficient amount of silicon oxide particles are dispersed to improve the dimensional constancy and mechanical strength of the resin without compromising the radiation transmittance.
[0183] In addition, the radiation cured product obtained by curing has transparency, high surface hardness, and low shrinkage during curing. In addition, the cured product has excellent properties, preferably having both dimensional constancy and adhesiveness, more preferably the degree of surface curing, and particularly preferably adhesive dur...
Embodiment 1
[0271] [a] Preparation of tetramethoxysilane oligomer
[0272] After mixing 234 g of tetramethoxysilane and 74 g of methanol, 22.2 g of 0.05% hydrochloric acid was added thereto and hydrolysis was performed at 65° C. for 2 hours. Then, the temperature in the system was increased to 130°C. After removing the formed methanol, after passing the methanol, the temperature was gradually increased to 150° C. and maintained for 3 hours to remove the tetramethoxysilane monomer.
[0273] [b] Preparation of silica particles
[0274] To 30.8 g of tetramethoxysilane oligomer prepared by the above operation, 62.4 g of methanol was added. After stirring, 0.31 g of aluminum acetylacetonate as a catalyst was dissolved in a homogeneous solution. To this solution, 6.5 g of desalinated water was gradually added dropwise, and the whole was stirred at 60°C for 2 hours to grow silicon oxide particles. Using a TEM electron microscope, by observing the morphology, it is estimated that the diameter of the ...
Embodiment 2
[0288] A cured resin product was obtained in the same manner as in Example 1, except that 280 g of bis(isocyanatocyclohexyl)methane was used in step [d] instead of 222.3 g of isophorone diisocyanate. Various physical properties of the composition and cured resin product are shown in Tables 1 and 2. The product shows the following properties: high light transmittance and surface hardness, low shrinkage and linear expansion coefficient during curing, and excellent surface curing and adhesion. When trying to dissolve the cured resin product in toluene, chloroform, acetone, and tetrahydrofuran, the cured resin product is basically insoluble in any solvent of toluene, chloroform, acetone, and tetrahydrofuran.
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