Optical interconnection coupling structure based on soft photoetching

Abstract

The optical interconnection coupled structure based on soft photoetch includes two reflecting surfaces and two intermediate coupled matching sections, they are successively connected on two sides of square waveguide tube, and formed into a symmetrically-connected connection body and mounted on the printed circuit board, on the printed circuit board the through holes are opened, its light source and light receiver are placed on another side of printed circuit board, the light source is aligned with one reflecting surface by means of first through hole, and the light receiver is aligned with another reflecting surface by means of second through hole. The square waveguide tube can be one-step formed by utilizing soft photoetching process. Said structure is applicable to internal short-distance high-speed data transmission in the computer.

Description

Technical field [0001] The invention relates to an optical interconnection coupling structure based on soft lithography. Background technique [0002] With the rapid growth of global communication traffic, business forms are becoming increasingly diversified, image transmission and processing technology is developing day by day, and bandwidth requirements are exploding, requiring each node on the network to provide a higher transmission rate. In the past two decades, optical signals have been widely used as information transmission media for long-distance network transmission. Long-distance communication network systems use parallel optical fibers to connect optical switches, routers, and WDM terminal systems for long-distance network interconnection. On the other hand, the microelectronics industry has greatly improved the performance of electronic circuits to alleviate this problem, but with the high integration of large-scale integrated circuits (LSI) and the increase in data ...

AI Technical Summary

Problems solved by technology

In order for the polymer optical interconnection to be applied to the interconnection between chips (such as printed circuit boards), two key problems need to be solved at the same time: one is how to couple the light beam emitted by the light source to the optical waveguide placed perpendicular to it, and make the light beam Alignment tolerance accuracy drops to 0.1-0.3mm, making practical possible

The main problem that still exists is how to deflect the signal optical path between the optical transmitter module and the optical detector by 90 degrees to more effectively couple with the optical waveguide; the other is how to reduce the reduction in optical signal coupling efficiency due to installation errors

In addition, the complex cost of the manufacturing process of the proposed several methods is too high, and it is difficult to produce in batches.

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