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Semiconductor device, semiconductor module, and manufacturing method of semiconductor device

A manufacturing method, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, radiation control devices, etc., can solve the problems that moisture cannot be discharged quickly and fully outside, condensation in closed spaces, etc., to achieve reliability and environmental resistance Excellent performance and anti-condensation effect

Inactive Publication Date: 2006-03-08
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the technology disclosed in Japanese Patent Application Laid-Open No. 3-151666, in the adhesive used to attach the cover glass 102 to the chip 100, moisture intrudes into the inside from the bonded part in a high-temperature and high-humidity environment. However, the intruded moisture cannot be quickly and fully discharged to the outside, so there is a problem of condensation in a closed space.

Method used

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  • Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
  • Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
  • Semiconductor device, semiconductor module, and manufacturing method of semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0077] 3A and 3B are explanatory diagrams showing a schematic configuration of an imaging device as a semiconductor device according to Embodiment 1 of the present invention. 3A is a plan view of the imaging device viewed from one side (a plane, a surface); FIG. 3B is a cross-sectional view of the structure at line A-A of FIG. 3A.

[0078] An imaging device 1 as a semiconductor device according to Embodiment 1 of the present invention is provided with: a semiconductor substrate 10 forming a rectangular imaging element 11 in plan view; Facing arrangement; an adhesive layer 14 formed on one surface of the imaging element 11 in a region other than the light receiving portion 12 and bonding the semiconductor substrate 10 (imaging element 11 ) and the cover portion 13 .

[0079] The imaging device 1 takes in light from the outside through the cover portion 13 , and receives the light (light detection) by a light receiving element arranged on the light receiving portion 12 of the im...

Embodiment approach 2

[0122] 9A, 9B, and FIGS. 10A to 10C are explanatory diagrams showing a method of manufacturing an imaging device as a semiconductor device according to Embodiment 2 of the present invention; An explanatory diagram of a state in which an adhesive layer is formed on one side (the surface having a light-receiving portion); FIGS. 10A to 10C show that the light-transmitting plate is bonded to the semiconductor wafer on FIGS. Explanatory diagram of the process of forming the lid.

[0123] FIG. 9A shows a pattern in which an adhesive layer 14 is patterned in the surrounding area except for the light receiving portion 12 of each imaging element 11 on one side (the plane having the light receiving portion 12) of a plurality of imaging elements 11 formed on the semiconductor wafer 30. state. Fig. 9B is a cross-sectional view of the structure at line A-A of Fig. 9A. In addition, this state is the same as the state shown in FIGS. 6A and 6B in Embodiment 1, and process conditions such as f...

Embodiment approach 3

[0130] 11 is a structural sectional view showing a schematic configuration of a semiconductor module according to Embodiment 3 of the present invention. The semiconductor module 2 is, for example, a camera module, and a lens 41 for capturing light from the outside and a lens holding mechanism 42 for holding the lens 41 are mounted on a wiring substrate 40 such as a printed circuit board or a ceramic substrate. A digital signal processor (hereinafter referred to as DSP) 43 is mounted on the wiring board 40 . The DSP 43 controls the operation of the imaging device 1 (imaging element 11 ), appropriately processes signals output from the imaging device 1 (imaging element 11 ), and functions as a control unit (image processing device) that generates signals necessary for optical instruments. The connection terminals of the DSP 43 and wiring (not shown) formed on the wiring board 40 are wire-bonded and electrically connected by bonding wires 43w.

[0131] On the DSP 43 formed as a ...

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PUM

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Abstract

An imaging device as a semiconductor device includes a semiconductor substrate on which an imaging element is mounted, a light-transmitting lid section (covering section) arranged to face a light receiving section provided on one surface of the imaging element, and an adhesive layer arranged in an area excluding the light receiving section on the one surface of the imaging element for bonding between the semiconductor substrate and the lid section. The adhesive layer ranges from 10 g / (m 2 ·24h) to 200 g / (m 2 ·24h) in the water vapor permeability.

Description

technical field [0001] The present invention relates to a semiconductor device provided with a cover portion on a semiconductor substrate, a semiconductor module using the semiconductor device, and a manufacturing method of the semiconductor device, and more particularly relates to a method for preventing the inside of a space formed between the semiconductor substrate and the cover portion A semiconductor device in which dew condensation occurs, a semiconductor module, and a method for manufacturing the semiconductor device. Background technique [0002] Imaging devices such as area sensors and line sensors using imaging elements such as CCDs and CMOS imaging devices, which are one type of semiconductor devices, are being put into practical use in various fields. The imaging device is composed of a light receiving unit such as a photodiode, a readout unit that reads out an electrical signal output from the light receiving unit, and the like. [0003] FIG. 1 is a plan view ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H01L27/14H01L23/10H01L23/28H04N25/00
CPCH01L27/14685H01L27/14625H01L31/0203H01L27/1462H01L27/14618H01L2224/48091H01L2224/73265H01L2924/00014H01L27/146
Inventor 塚本弘昌藤田和弥安留高志
Owner SHARP KK