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Solution for etching copper surfaces and method of depositing metal on copper surfaces

A solution and etching technology, which is applied to the improvement of metal adhesion of insulating substrates, metal material coating process, liquid chemical plating, etc., can solve the problems of increased analysis costs, narrow operating range of etchant, and can not be satisfied at the same time, to achieve Improved adhesive strength and easy analysis

Inactive Publication Date: 2006-04-26
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The operating range of the etchant is very narrow, which results in a significant increase in the analysis cost of the bath
[0021] Therefore, the following requirements cannot be met simultaneously with known methods and treatment solutions:

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] Example 1a - Example according to the invention:

[0083] Prepare an aqueous solution by mixing the following ingredients:

[0084] Phenol-4-sulfonic acid (without sulfate) 50g

[0085] Hydrogen peroxide 35% (w / v) 100g

[0086] Add deionized water to bring the volume to 1 L.

[0087] The resulting solution was heated to 23°C. Then, two pieces of copper foil (printed circuit board quality) were immersed in the solution for 120 seconds according to the above-mentioned steps. After treatment with warm deionized water, they were dried. One piece of copper foil was used to determine the residual roughness, while the other piece of copper foil was metallized according to the procedure described.

[0088] The copper layer of the foil analyzed had a satin to bright luster and had a residual roughness of 44 nm. No speckling was formed on its way to the rinse tank. The etching rate was 0.66 μm / min. After tin plating, there is adhesion between the copper surfac...

Embodiment 2

[0096] Example 2 - Example according to the invention:

Embodiment 1b

[0098] Toluene-4-sulfonic acid (without sulfate) 25g

[0099] Hydrogen peroxide 35% (w / v) 100g

[0100] Polyethylene glycol (polymerization degree: 100-400) 25ml

[0101] Add deionized water to bring the volume to 1 L.

[0102] The copper layer has a satin to bright luster and a residual roughness of 43nm. No speckling was formed on its way to the rinse tank. The etch rate was 1.8 gm / min. After nickel plating, it was found that there was adhesion between the copper surface and the applied nickel layer.

[0103] By adding polyethylene glycol in Example 2, a lower etch rate and thus a lower residual roughness are obtained compared to Example 1b.

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Abstract

A solution used to etch copper or copper alloys to produce the brightest possible copper surface for subsequent metal plating. The solution has a pH of about 4 or less and contains no sulfate ions. The solution contains: a) at least one oxidizing agent selected from hydrogen peroxide and peracid; b) at least one substance selected from aromatic sulfonic acids and aromatic sulfonates; and optionally c) at least one N-heterocyclic compounds. The application also discloses a method of depositing metal onto the surface of copper or copper alloy. The method comprises the steps of a) contacting the surface with a solution according to the invention; and b) coating the surface with at least one metal. The solution and the method are particularly suitable for the production of circuit carriers, more particularly for semiconductor production.

Description

technical field [0001] The invention relates to a solution for etching copper or copper alloys and a method for depositing metal on copper or copper alloy surfaces which have been previously etched with said solution. The solutions and methods are preferably used for the production of circuit carriers, in particular printed circuit boards, or suitable for semiconductor technology, as well as for the production of leadframes and contacts (such as multi-point connectors and contacts in switches), plug and socket connections devices, sockets and plugs. Background technique [0002] During the manufacture of the circuit carrier, the copper surface is treated with an etching solution to remove contamination from the surface or to prepare the surface for subsequent processing. Thus to remove 1-2μm of copper. Then in subsequent processing, organic or metallic layers are applied. These layers serve different functions. The metal layer may, for example, fo...

Claims

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Application Information

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IPC IPC(8): C23F1/18C23C18/18C23F3/06H01L21/3213H05K3/24H05K3/38
CPCC23F1/18C23F3/06H05K3/244H05K3/383C23C18/1844C23C18/31C23C18/50H01L2924/0002H01L2924/00H01L21/3213
Inventor 哈特穆特·马尔考克里斯蒂安·斯帕林
Owner ATOTECH DEUT GMBH
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