Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Fluid jet device and method for controlling jet quality of fluid jet device

A technology of fluid injection and fluid control, which is applied to the device, printing, coating and other directions of coating liquid on the surface, which can solve the problem of insufficient data and so on

Inactive Publication Date: 2006-05-10
BENQ CORP
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This random sampling method can provide a certain reference value for the film thickness of the entire wafer, but for hundreds of fluid ejection devices on the wafer, the data measured by the aforementioned method is obviously insufficient

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fluid jet device and method for controlling jet quality of fluid jet device
  • Fluid jet device and method for controlling jet quality of fluid jet device
  • Fluid jet device and method for controlling jet quality of fluid jet device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0058] During the manufacturing process of the fluid ejection device 10A, acid (HF-49%) and alkali (KOH-30%) etchant are used to etch the substrate 100 or the sacrificial layer (not shown) of the wafer, and the structural layer 110 provides protection The role of etching solution.

[0059] To achieve the above purpose, the structure layer 110 is preferably made of low-stress (~100 MPa and tensile stress) silicon nitride deposited by LPCVD process. However, in actual fabrication, it is found that during the etching process, defects such as cracks will occur if the structure layer 110 is too thin (<0.4 um), and the surface circuits will be damaged. As for the completed device, it was also found during testing that the structural layer 110 with different thicknesses (0.6-1.2 um) has a great impact on the driving conditions of fluid ejection (including heating time or driving voltage).

[0060] Figure 2B is a partially enlarged schematic diagram showing a sensor 150 according t...

no. 2 example

[0072] According to the object of the present invention, the present invention further provides a method for controlling the spraying quality of a fluid spraying device. As in the aforementioned microfluid ejection device, the heater is carried on the structural layer, and the heat generated by the heater is transferred to the fluid in the fluid cavity through the structural layer. According to the principle of heat transfer, the same material has the same heat transfer number k, and under the same temperature difference ΔT, the heat flux J is inversely proportional to the transfer distance L, (ie J=-k / L). Therefore, under the same driving conditions of the above-mentioned fluid ejection device, the ejection effect of the fluid ejection device will vary with the thickness of the structural layer, resulting in unstable ejection quality.

[0073] According to known techniques, the turn-on energy required for droplet firing to achieve the same jetting effect, the structural layer...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Dielectric constantaaaaaaaaaa
Dielectric constantaaaaaaaaaa
Login to View More

Abstract

The invention provides a liquid ejecting device and a method for controlling the ejecting quality. The inventive device comprises a liquid chamber with the first layer to contain the liquid; at least one foam generator arranged on the first layer and opposite to the liquid chamber; a sensor to measure the thickness of first layer; second layer formed on the first layer to cover foam generator and sensor; a ejecting hole near the foam generator and through the second, first layers and liquid chamber. The invention compares the thickness of structural layer measured by sensor with the inside data base via a comparer, to support optimizated liquid ejecting driving conditions and improve the ejecting quality.

Description

technical field [0001] The invention relates to a fluid ejection device technology, in particular to a fluid ejection device system including a sensor and a method for controlling fluid ejection quality. Background technique [0002] Microfluid ejection devices have recently been widely used in the information industry, such as in inkjet printers or the like. With the gradual development of micro system engineering, this kind of fluid injection device has gradually been applied in many other fields, such as fuel injection system (fuel injection system), cell sorting (cell sorting), drug delivery system (drug delivery system) ), printing lithography (print lithography) and micro jet propulsion system (micro jet propulsion system), etc. In the aforementioned application fields, a more successful design is to use thermal driven bubbles to eject liquid droplets. It is also the most commonly used due to its simple design and low cost. [0003] figure 1 The monolithic fluid ej...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B41J2/01B05C5/00
Inventor 周忠诚黄宗伟
Owner BENQ CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com