Preparation of silane modified EVA hot-melt adhesive composition

A composition, hot-melt technology, applied in the direction of adhesive types, monocarboxylate copolymer adhesives, etc.

Inactive Publication Date: 2006-07-12
杨隽
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, there are no silane-modif

Method used

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  • Preparation of silane modified EVA hot-melt adhesive composition
  • Preparation of silane modified EVA hot-melt adhesive composition
  • Preparation of silane modified EVA hot-melt adhesive composition

Examples

Experimental program
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Embodiment Construction

[0023] In certain embodiments of the invention, the bonded substrates are relatively thin and flat, in which case the resulting composite article is referred to as a laminate or laminated structure.

[0024] Implementation with 1

[0025] Install protective gas, thermometer, stirrer, and heating system on the reaction vessel. First add EVA resin, appropriate amount of initiator, silane graft, and antioxidant into the container, and raise the temperature to 110°C under gas protection. React at 110°C for 30 minutes, then lower the temperature to 90°C, add tackifying resin, paraffin and catalyst and react in nitrogen atmosphere for one hour, keeping the temperature at 100-105°C. Finally, the reaction product is poured into a container, granulated after cooling, and sealed for storage.

[0026] Reactive extrusion method or melt grafting method to prepare silane-modified EVA resin process chemical reaction formula;

[0027] ① Decompose peroxide into primary free radicals:

[...

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PUM

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Abstract

The invention provides a silicon alky quenching EVA heat fusion glue compound which grafts the active silane group on the EVA resin macro-chain by squeezing or fusion reaction and uses the silane group to do cross bonding reaction to improve the heat preservation and adhesion property of the heat fusion glue series.

Description

technical field [0001] The present invention relates to a moisture-reactive hot melt composition useful as an adhesive, to a method of preparing such a composition, to a method of bonding substrates with such a composition, and to adhesives prepared by such a bonding method. Bonded composite products. Some hot melt compositions that are reactive to moisture can be used as reactive hot melt adhesives. Some desirable properties of this type of adhesive are higher heat resistance; high ultimate strength (including peel strength, bond strength) It is well known in the art that such formulations lack heat resistance and have unsatisfactory mechanical properties. It is an object of the present invention to provide moisture-curable hot-melt compositions which achieve high bond strength values ​​in practical times, which adhere well to polyolefins and other difficult-to-bond substrates and achieve the desired high level of heat resistance. Background technique [0002] At present...

Claims

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Application Information

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IPC IPC(8): C09J131/04
Inventor 杨隽
Owner 杨隽
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