Electroless gold plating solution
An electroless gold plating and chemical compound technology, which is applied in the field of plating technology and electroless gold plating solution, can solve the problems of insufficient adhesion, corrosion, and insufficient welding strength of the electroless nickel plating film
Active Publication Date: 2006-07-12
JX NIPPON MINING & METALS CO LTD
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Problems solved by technology
Depending on the situation, the defects are either continuous or concentrated, and even cause poor appearance of the gold-plated film (porous corrosion on the surface)
Furthermore, although the film thickness of the precipitated gold film is very thin, less than or equal to 0.1 μm, due to the deep erosion depth, the weakening of the electroless nickel plating film caused by such a displacement type gold plating solution and the lack of adhesion to the gold plating film, Therefore, peeling occurs during the durability test, and sufficient welding strength cannot be ensured during welding
In such a prior art electroless gold plating solution, inferior products are produced due to pit corrosion on the surface of the gold plating film and insufficient soldering strength, which has become a big problem in ball matrix array (BGA) type semiconductor packages and the like.
Method used
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Embodiment 1～2 and comparative example 1～2
[0091] Gold plating solution baths of the respective compositions shown in Table 1 were prepared. A copper-plated printed wiring board was used as a material to be plated, and the steps up to electroless gold plating were performed as follows, and electroless gold plating was performed under the conditions described in Table 1.
[0092] Acid degreasing process (KG-512 manufactured by Nippon Metallurgical Technology Co., Ltd.) 45°C, 5 minutes
[0093] →Hot water washing 50~60℃, 1 minute
[0094] →washing
[0095] →Soft etching (sodium persulfate 80g / L, sulfuric acid 20ml / L)
[0096] →washing
[0097] → Acid washing (sulfuric acid 30ml / L)
[0098] →washing
[0099] →Activation (KG-522 manufactured by Nippon Mining Metal Plastics Co., Ltd.) at 25°C for 3 minutes
[0100] →washing
[0101] →Acid dipping (sulfuric acid 30ml / L)
[0102] →washing
[0103] →Electroless nickel plating (KG-530 manufactured by Nippon Mining Metal Plating Co., Ltd.) 85°C, 3 minutes
[0104] →was...
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An electroless gold plating solution with which a gold plating film free of pitting corrosion at its surface can be obtained, which gold plating film when soldered realizes satisfactory soldering strength. In particular, an electroless gold plating solution characterized by containing a water soluble compound of gold and further containing as a reducing agent a hydroxyalkylsulfonic acid of the following general formula or salt thereof and an amine compound. (wherein R represents any of hydrogen, carboxyl, substituted or unsubstituted phenyl, naphthyl, saturated or unsaturated alkyl, acetyl, acetonyl, pyridyl and furyl; X represents any of hydrogen, Na, K and NH4; and n is an integer of 0 to 4.
Description
technical field [0001] The invention relates to a plating technology and an electroless gold plating solution. Background technique [0002] Electroless gold plating is suitable for the circuit of printed wiring boards, IC packages, ITO substrates, IC cards and other electronic industry components such as joints and circuit surfaces. [0003] In the case of substitution-type electroless gold plating with a thickness of 0.05-0.1 μm on the base electroless nickel-plating film, especially immediately after the plating reaction starts, the substitution reaction between nickel and gold is very fast, and the electroless nickel plating is selectively and strongly attacked Erosion of the precipitated particles progresses deeply in the grain boundary portion of the precipitated particles in the film, and a defect portion is formed under the gold-plated film. Depending on the situation, the defective parts are either continuous or concentrated, and even cause poor appearance of the g...
Claims
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Login to View More IPC IPC(8): C23C18/44H05K3/24
CPCH05K3/244C23C18/44H05K3/181
Inventor 伊森彻日角义幸藤平善久
Owner JX NIPPON MINING & METALS CO LTD