Encapsulation casing, substrate, and sealing structure for moisture-sensitive electronic components

A technology for encapsulating shells and electronic devices, which is applied in the directions of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of reducing the adhesion performance of substrates and encapsulation shells, and achieve good adhesion performance, packaging effect, and packaging effect. Effect

Inactive Publication Date: 2006-07-19
TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the water-oxygen barrier capability of the substrate and the packaging shell is generally much higher than that of the sealing material, and water and oxygen are more likely to enter the device from the sealing material between the substrate and the packaging shell, so reducing the thickness of the sealing material in contact with the environment can effectively reduce the...

Method used

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  • Encapsulation casing, substrate, and sealing structure for moisture-sensitive electronic components
  • Encapsulation casing, substrate, and sealing structure for moisture-sensitive electronic components
  • Encapsulation casing, substrate, and sealing structure for moisture-sensitive electronic components

Examples

Experimental program
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Effect test

Embodiment 1

[0020] Glass substrate / ITO / NPB(50nm) / Alq(50nm) / Mg:Ag / glass sheet with a ring of grooves

[0021] (1) Cleaning of glass substrates pre-engraved with ITO: use hot detergent ultrasonic and deionized water ultrasonic methods to clean the transparent conductive substrate ITO glass, place it under an infrared lamp to dry after cleaning, and then The dried ITO glass is pretreated by ultraviolet ozone cleaning and low-energy oxygen ion beam bombardment. The ITO film on the conductive substrate is used as the anode layer of the device. The square resistance of the ITO film is 50Ω and the film thickness is 150nm;

[0022] (2) Preparation of the organic light-emitting layer: the above-mentioned cleaned and dried ITO glass that has been pretreated is placed in a vacuum chamber, and the vacuum is evacuated to 1×10 -3 Pa, and then evaporate a layer of hole transport material NPB on the above-mentioned ITO film, the evaporation rate of the material film is 0.5nm / s, and the film thickness is ...

Embodiment 2

[0026] Glass substrate / ITO / NPB / Alq / Mg:Ag / PI / glass sheet with two grooves

[0027] The preparation steps are the same as in Example 1, except that two circles of grooves 302 with a depth of 1 mm and a width of 0.75 mm are made on the packaging glass 303, glue is dispensed on the two circles of grooves, and then the packaging glass 303 is pressed together and the substrate 301, the thickness of the sealing material exposed to gas was 4 μm.

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Abstract

The invention relates to a sealing case, base and sealing structure of humidity sensitive electric device, which can reduce the thickness of the part of sealing material that contacting the environment without reducing the thickness of sealing material. The edge of sealing case and/or base comprises one or several grooves to be filled with sealing material; the humidity sensitive electric device can be used in organic electric lighting device, micro electro-mechanical sensor or the charge-coupled device sensor. The invention via preparing the grooves on the base and/or sealing case fills the sealing material into the grooves to reduce the thickness of the part of sealing material that contacting the environment without reducing the thickness of sealing material, to improve the sealing effect without reducing the adhesive property of base and sealing case, and when there are more grooves, the adhesive property and sealing effect can be improved.

Description

technical field [0001] The invention relates to a package casing, a base and a sealing structure of a moisture-sensitive electronic device. Background technique [0002] Humidity-sensitive electronic devices are very sensitive to water and oxygen in the environment, and usually need to be packaged, such as organic electroluminescent devices (OLED), charge-coupled device sensors (CCD), and micro-electromechanical sensors (MEMS). An effective method of encapsulation is to use a sealing material to bond the substrate of the device and the package shell together. [0003] In order to further enhance the encapsulation effect, a desiccant is usually added between the encapsulation shell and the substrate. [0004] However, with the improvement of device performance requirements, the existing packaging effect still cannot meet the requirements of the device, because as the area of ​​the device exposed to environmental water and oxygen increases, the amount of water and oxygen infi...

Claims

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Application Information

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IPC IPC(8): H01L23/02H01L23/12H01L51/10H01L29/765
Inventor 邱勇张德强高裕弟徐粤周少华
Owner TSINGHUA UNIV
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