Encapsulation casing, substrate, and sealing structure for moisture-sensitive electronic components

A technology for encapsulating shells and electronic devices, which is applied in the directions of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of reducing the adhesion performance of substrates and encapsulation shells, and achieve good adhesion performance, packaging effect, and packaging effect. Effect
CN1805130AInactive Publication Date: 2006-07-19TSINGHUA UNIV +1
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
TSINGHUA UNIV
Publication Date
2006-07-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a sealing case, base and sealing structure of humidity sensitive electric device, which can reduce the thickness of the part of sealing material that contacting the environment without reducing the thickness of sealing material. The edge of sealing case and / or base comprises one or several grooves to be filled with sealing material; the humidity sensitive electric device can be used in organic electric lighting device, micro electro-mechanical sensor or the charge-coupled device sensor. The invention via preparing the grooves on the base and / or sealing case fills the sealing material into the grooves to reduce the thickness of the part of sealing material that contacting the environment without reducing the thickness of sealing material, to improve the sealing effect without reducing the adhesive property of base and sealing case, and when there are more grooves, the adhesive property and sealing effect can be improved.
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Description

technical field

[0001] The invention relates to a package casing, a base and a sealing structure of a moisture-sensitive electronic device. Background technique

[0002] Humidity-sensitive electronic devices are very sensitive to water and oxygen in the environment, and usually need to be packaged, such as organic electroluminescent devices (OLED), charge-coupled device sensors (CCD), and micro-electromechanical sensors (MEMS). An effective method of encapsulation is to use a sealing material to bond the substrate of the device and the package shell together.

[0003] In order to further enhance the encapsulation effect, a desiccant is usually added between the encapsulation shell and the substrate.

[0004] However, with the improvement of device performance requirements, the existing packaging effect still cannot meet the requirements of the device, because as the area of ​​the device exposed to environmental water and oxygen increases, the amount of water and oxygen infi...

Claims

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