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Photosensitive resin compound

A technology of photosensitive resin and composition, which is applied in optics, optomechanical equipment, nonlinear optics, etc., can solve the problems of insufficient storage stability and heat resistance of radiation-sensitive resin compositions, and achieve excellent storage stability, The effect of excellent heat resistance

Active Publication Date: 2011-09-14
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the composition for forming a spacer described in JP-A-11-133600 does not have sufficient storage stability, and the radiation-sensitive resin compositions described in JP-A-6-192389 and 10-319592 do not have sufficient storage stability. heat resistance

Method used

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  • Photosensitive resin compound
  • Photosensitive resin compound

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0145] The constituent units of the binder resin Aa used in Example 1, Comparative Example 1, and Comparative Example 2 are shown in formula (X).

[0146]

[0147] Description of constituent units

[0148] a: Corresponding to the constituent unit derived from (A1) in copolymer 1

[0149] b: Corresponds to the constituent unit derived from (A2) in copolymer 1

[0150] c: Corresponds to a constituent unit derived by reacting (A3) with a constituent unit derived from (A4) in copolymer 1

[0151] d: Corresponds to a constituent unit derived by reacting (A5) with a moiety derived from (A3) in copolymer 2

[0152] Table 1 shows the molar ratio of constituent units a to d in resin Aa, R 2 , the weight average molecular weight and molecular weight distribution of the obtained resin Aa based on polystyrene calibration standards.

[0153] Table 1

[0154]

Resin Aa

a

0.25

b

0.25

c

0.15

d

0.35

R 2

-CH 3

M w

1...

Embodiment 2

[0167] In the same manner as in Synthesis Example 1 of JP-A-11-133600, 7 parts by weight of 2,2'-azobis(2,4-dimethyl valeronitrile) and 200 parts by weight of diethylene glycol dimethyl ether. Subsequently, 30 parts by weight of styrene, 20 parts by weight of methacrylic acid, and 50 parts by weight of glycidyl methacrylate were added and purged with nitrogen, followed by stirring gently. The temperature of the solution was raised to 70° C. and maintained at this temperature for 5 hours to obtain a polymer solution containing resin Ab. The resulting resin Ab had a weight average molecular weight of 24,000 based on polystyrene calibration standards.

[0168] Example 1

[0169] [Preparation of Photosensitive Resin Composition 1]

[0170] 50 parts (converted to solids) of resin Aa obtained above, 50 parts of dipentaerythritol hexaacrylate (KAYARAD DPHA; produced by Nippon Kayaku Co., Ltd.), 3 parts by weight of 2-benzyl-2-dimethylamino -1-(4-morpholinophenyl)-butanone (Irgacu...

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PUM

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Abstract

The present invention relates to a photosensitive resin composition including (A) adhesive resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a solvent and a compound as shown in the expression I in which X, Y and Z each respectively represents single bond, perssad of I-1 or I-2; R<1> to R<3> each respectively represents hydrogen atom, halogen atom, and alkyl or alkoxy having 1 to 6 carbon atoms; R<1>, R<2> and R<3> on the same benzene ring can be the same or different with each other while R<4> to R<6> each respectively represents hydrogen atom or alkyl having 1 to 4 carbon atoms.

Description

technical field [0001] The invention relates to a photosensitive resin composition. Background technique [0002] Between the array substrate and color filters constituting a display such as a liquid crystal display, a touch panel, etc., a spacer for maintaining a gap between the two substrates is provided. As for the method of forming such a spacer, there is proposed a photo-spacer method in which a spacer is formed using a photosensitive resin composition instead of sputtering spherical particles. [0003] As a photosensitive resin composition for forming a photo-isolator, known compositions include copolymers containing constituent units derived from (a1) unsaturated carboxylic acids and / or unsaturated carboxylic acid anhydrides, (a2) An epoxy group-containing unsaturated compound, and (a3) ​​an ethylenically unsaturated compound other than the above-mentioned (a1) and (a2). It is disclosed that the separator can be obtained by crosslinking the carboxyl group and epoxy ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G02F1/1339G02F1/133
CPCG03F7/0007G03F7/0045G03F7/032
Inventor 武部和男
Owner SUMITOMO CHEM CO LTD
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