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Silicon nitride heating body and its pressureless lower temperature sintering producing method

A silicon nitride heating element, silicon nitride technology, applied in the direction of heating element materials, etc., can solve the problems of limited scale effect, high energy consumption, low production efficiency, etc., achieve product variety, expand application fields, chemical good stability

Inactive Publication Date: 2006-10-18
SHENZHEN JINKE SPECIAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the manufacturing method of silicon nitride heating elements is mainly based on the traditional high-temperature and high-pressure process, which consumes a lot of energy, and the high-temperature and high-pressure furnace is a separate furnace body, which cannot achieve continuous production, and the production efficiency is relatively low. On the one hand, it cannot meet the strong demand of the future market. Demand, on the other hand, also inherently limits the scale effect and cost reduction

Method used

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  • Silicon nitride heating body and its pressureless lower temperature sintering producing method
  • Silicon nitride heating body and its pressureless lower temperature sintering producing method
  • Silicon nitride heating body and its pressureless lower temperature sintering producing method

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Embodiment 1

[0019] The silicon nitride heating element of the present invention is made through the following process steps:

[0020] Dry-press buried wire non-pressure low-temperature sintering process:

[0021] Raw material preparation: weighing according to the formula of silicon nitride 90%, magnesium oxide 2%, yttrium oxide 2%, aluminum oxide 5%, silicon oxide 1%, put into a ball mill jar and add ethanol for ball milling for 12 hours, then pour Put it into a container, dry it in an oven, and sieve it for later use.

[0022] Blank preparation: Process the metal mold according to the shape requirements of the heating element of 150mm×30mm×5mm, and press the mixed material powder processed by the above process into the blank, and place the heating wire on the blank according to the set requirements while pressing the blank inside, as attached figure 1 , attached figure 2 Shown in, press molding under the pressure of 20MPa.

[0023] Debinding process: Put the above-mentioned ceramic...

Embodiment 2

[0026] Rolled film screen printing pressureless low temperature sintering process:

[0027] Raw material preparation: silicon nitride 70%, magnesium oxide 10%, yttrium oxide 10%, aluminum oxide 5%, silicon oxide 5%. The formula was weighed, put into a ball mill jar and added ethanol for ball milling for 12 hours, then poured into a container, dried in an oven, and sieved for later use.

[0028] Plain embryo preparation: add binder to the mixed material powder treated by the above process, the binder is mainly composed of polyvinyl butyl ester, phthalate dibutyl ester, n-butanol, trichloroethylene, tetrachloroethylene , ethanol, nitroglycerin and other binders for roll forming, and then cut into the required size and shape of the molded sheet substrate, including the upper ceramic substrate and the lower ceramic substrate, such as image 3 and Figure 4 shown. The lower ceramic substrate is screen-printed with electrothermal film slurry, and the upper and lower ceramic subst...

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Abstract

A silicon nitride heat body is prepared from silicon nitride of 70-95%, Ytterbium oxide of 0.1-10%, aluminum nitride of 0-5%, boron nitride of 0-5 %, aluminum oxide of 0.1-10%, silicon oxide of 0.1-10%, cerium oxide of 0.1-10% and magnesium oxide of 0.1-10%. Its preparing method includes weight out raw materials in weight radio as said preparation and ball-grinding them for 2-48hr., drying and dry-pressing them to be biscuit, placing heat wire in biscuit for making it be green bodies being set in furnace for depasting, placing green bodies into graphite crucible and burying it in silicon nitride at furnace temperature of 1500-1800 deg.c for sintering of 0.5-4hr..

Description

Technical field: [0001] The invention relates to a silicon nitride heating element and a pressureless low-temperature sintering preparation method thereof, belonging to an electric heating element and a sintering method of the electric heating element. technical background: [0002] At present, instant electric water heaters and instant faucets using silicon nitride as a heating element have been supplied in the domestic market. Instant electric water heaters combine the advantages of gas water heaters and storage-type electric water heaters, and have the advantages of rapid heating, sustainable hot water supply, small size, safety and environmental protection. The silicon nitride heating element heats up quickly and can be used continuously without waiting, so the hot water usage rate is almost 100%, saving electricity and energy, the heating pipe is not easy to scale, and has a longer service life. At present, the manufacturing method of silicon nitride heating elements i...

Claims

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Application Information

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IPC IPC(8): H05B3/10C04B35/584C04B35/622
Inventor 郜长福陈闻杰刘晓霞
Owner SHENZHEN JINKE SPECIAL MATERIALS CO LTD
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