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Hard film layer dedicated for micro-bore of flexible printed circuit board

A technology of printed circuit and hard film layer, which is applied in the direction of drilling repair, layered products, drilling tool accessories, etc. It can solve the problems of low film density, poor bonding force between film and substrate, and low ionization rate of sputtering deposition. , achieve high thermal conductivity, increase bonding force, and high toughness

Inactive Publication Date: 2006-11-22
浙江汇锦梯尔镀层科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The control of the magnetron sputtering coating process is relatively easy, and the surface of the film layer is smooth, but generally the ionization rate of sputtering deposition is low, the density of the film is low, and the bonding force between the film and the substrate is relatively poor.

Method used

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  • Hard film layer dedicated for micro-bore of flexible printed circuit board
  • Hard film layer dedicated for micro-bore of flexible printed circuit board

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Effect test

Embodiment 1

[0035] The film layer is CrN (chromium nitride). The number of layers of the film is three layers.

[0036] a. Transition layer Cr (chromium): the composition of this layer is all metal chromium, and the film thickness is 0.05 μm; b. Nitride transition layer: the ratio of Cr (chromium) metal to CrN (chromium nitride) is about 1: 8. The film thickness is about 0.1 μm; c. Nitride hard wear-resistant layer: the composition is CrN (chromium nitride), and the film thickness is about 0.6 μm.

Embodiment 2

[0038] The film layer is CrN (chromium nitride). The number of layers of the film is three layers.

[0039] a. Transition layer Cr (chromium): the composition of this layer is all metal chromium, and the film thickness is 0.1 μm; b. Nitride transition layer: the ratio of Cr (chromium) metal to CrN (chromium nitride) is about 1: 10. The film thickness is about 0.3 μm; c. Nitride hard wear-resistant layer: the composition is CrN (chromium nitride), and the film thickness is about 0.8 μm.

Embodiment 3

[0041] The film layer is CrTiAlN (chromium titanium aluminum nitrogen). The number of layers of the film is four.

[0042] The transition layer contains palladium, titanium and aluminum, wherein the ratio of chromium, titanium and aluminum is 60:1:0.6, and the film thickness is 0.05 μm;

[0043] The nitride transition layer includes an inner mixed layer 2 and an outer mixed layer 3 with a thickness of 0.1 μm and 0.4 μm respectively. The ratio of metal and metal nitride in the inner mixed layer 2 is controlled at 4:3, and the metal elements contained in it are chromium, titanium, The ratio of aluminum is 60:1:0.6; the ratio of metal and metal nitride in the outer mixed layer 3 is 0.5:3, and the ratio of the contained metal elements chromium, titanium and aluminum is controlled at 3:1:0.5.

[0044] Nitride hard wear-resistant layer, the composition of which is chromium, titanium, aluminum and nitrogen, and the film thickness is 0.5 μm. The nitride hard wear-resistant layer als...

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Abstract

The invention relates to a right film of micro drilling head used to drill the soft board of printed circuit board. It is characterized in the improvement of micro drilling special rigid film. Wherein, said film should have better abrasion and high-temperature resistant properties, to improve the quality and service life of drilling hole, and improve the processing efficiency of printed circuit board and reduce the producing cost. The preparation comprises: its base material is the general drilling head, whose surface has at least three films as transition layer that contains chrome, nitride transition layer that contains chrome and nitride chrome, nitride rigid abrasion resistant layer that contains nitride chrome, from inner to outer. Said transition layer, nitride transition layer and nitride rigid abrasion resistant layer can be added with titanium and aluminum, while the nitride transition layer comprises the inner mixed layer and the outer mixed layer.

Description

technical field [0001] The invention relates to a special hard film layer for a drill bit, in particular to a hard film layer on a micro drill bit used for drilling holes on a soft board of a printed circuit board when manufacturing a printed circuit. Background technique [0002] As the circuit pattern of the printed circuit board is getting finer and finer, the aperture on the printed circuit board is getting smaller and smaller (now reached φ0.1mm), and the wiring density is getting denser (L / S≤0.1mm / 0.1mm) , the processing speed is getting faster and faster (150-200 holes / min), which puts higher requirements on the carbide micro-machining tools and machining accuracy, because when drilling such micro-holes, φ0.1mm~φ0 The wear and breakage of .4mm micro-hole drills have a great impact on the processing quality, processing efficiency, reject rate, and processing cost of micro-holes. [0003] The research results show that the wear of FPCB (flexible printed circuit board) ...

Claims

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Application Information

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IPC IPC(8): B23B51/00B32B18/00B32B33/00
Inventor 江河周丹华
Owner 浙江汇锦梯尔镀层科技有限公司
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